Press release
Miniaturization of etched structures for mobile communications
Technical Director Marcus Lang proofs the etching quality of 30µm structures under a microscope
The patented process permits the production of traces with a width of just 20µm in homogeneous quality over an entire panel. For comparison purposes: a human hair is approx. five times as thick. The special feature: the micro-fine surface structures are so smooth that this also results in the additional optimization of the signal quality.
The growing functional range of smartphones, digital cameras and tablets requires a high level of integration density in the semi-conductor field and the miniaturization of electronic modules.
Until now, the use of faster microchips was virtually impossible due to increased heat generation. This problem can now be resolved by integrating the microchips within the flat module (embedded technology). This means that the use of chip carriers in connection technology is a thing of the past.
"Using this process not only protects the environment but also offers the electronics industry a quantum
leap in the reduction in the surface area of printed circuit boards in series production. New developments that so far have been unthinkable will now become possible. Increasing the pack density makes electronic modules faster and more powerful. Developers and programmers are able to set out upon entirely new paths to create new generations of equipment." adds Managing Director Wolfgang Dambacher.
The process has already been successfully implemented by a cooperation partner.
AKON developes several patented processes and components for the automotive and electrical industry.
The AKON systems provide a tremendous increase in quality. Furthermore the industrial processes are improved with respect to the environment, the health and the safety. All this you can achieve at a reasonable price.
AKON GmbH
Dr.-Rudolf-Schieber-Str. 11-15
73463 Westhausen
Germany
Tel: +49 (0)7363 / 954 958-0
E-Mail: info@akon-germany.com
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