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Thermal Interface Material (TIM) Market Worldwide Industry Analysis
Thermal Interface Material (TIM) Market,Thermal Interface Material, TIM, Thermal Interface Material (TIM) Market Research,
A thermal interface material (TIM) is a thermally conductive material, which acts as an interface between the heat sink and heat source. To minimize the interface, the thermal resistance between the source and heat sinks, while the small imperfections/void is filled with thermal interface materials. With the ongoing increase of power densities in electronics, the thermal interface between heat source and heat-sink becomes a larger challenge.
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Asia-Pacific dominated the global thermal interface market in 2014, followed by North America. Asia-Pacific has witnessed significant growth in the transportation, electronics & telecommunication sector over the past few years, thus resulting in increasing demand of thermal interface materials. As a result, a prominent market has emerged in the developing countries, such as China, India, Japan and South Korea.
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Medical sector is booming sector for the TIM, as the demand for effective, durable, smaller and lighter medical equipment is increasing enormously. Thermal interface materials have significant application in the transportation and automobile sector. The use of electronic vehicle in transportation requires efficient thermal management system.
Some of the key players competing in the market include, Henkel Corporation, 3M Company, Dow Corning, Fujipoly, Kitagawa Industries, Laird Tech, Parker Chomerics, Honeywell International, Cookson Electronics Assembly Materials, Zalman Tech & Wakefield-Vette Inc.
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