Press Releases from Tascon (1 total)
Low Energy Ion Scattering (LEIS): A unique tool for characterization of thin met …
The ongoing miniaturization of integrated circuits has in recent years led to an increasing replacement of traditional metal layer deposition methods like chemical or physical vapour deposition (CVD or PVD) by atomic layer deposition (ALD). ALD layers meet high standards with respect to layer closure and homogeneity and are used as diffusion barriers or dielectric layers.
Low Energy Ion Scattering (LEIS) has established itself as a technique for testing these…
