Press Releases from YINCAE Advanced Materials, LLC (4 total)
YINCAE Unveils Advanced Liquid Metal Thermal Interface Material with Superior Pr …
(Albany, NY) August 7, 2025 - YINCAE, a leader in electronic material solutions, today announced the launch of its next-generation Liquid Metal Thermal Interface Material…
YINCAE Showcases Next-Level Semiconductor Solutions at SEMICON SEA- Booth B2939
[May 8, 2025 | Albany, NY] - YINCAE Advanced Materials, a globally recognized leader in high-performance adhesives and electronic materials, is proud to announce its…
YINCAE: UF 158UL Redefines Underfill for Large Chips
03/11/2025 (Albany, NY) - YINCAE, a leading innovator in advanced materials solutions, today announced the launch of its groundbreaking underfill material, UF 158UL. This cutting-edge…
UF 120LA: The Next-Generation High reliability, 100% flux residue compatible and …
YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA eliminates cleaning…
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