Press release
YINCAE Showcases Next-Level Semiconductor Solutions at SEMICON SEA- Booth B2939
YINCAE to Showcase Cutting-Edge Electronic Materials at SEMICON SEA 2025 - Booth B2939
With decades of expertise and a relentless drive for innovation, YINCAE continues to shape the future of advanced microchip and optoelectronic device assembly. The company's comprehensive portfolio spans wafer level, package level, and board level materials designed to deliver reliability, performance, and manufacturing efficiency.
Discover YINCAE's Featured Product Lines at SEMICON SEA 2025:
Board Level Assembly Materials: Enhance PCB assembly and reliability with products such as:
• NC 256: A zero-residue flux designed specifically for microchip applications
• SMT 256: A high-performance dip adhesive that boosts solder joint integrity for CSP, BGA, and flip-chip packages
Underfill Materials: Strengthen mechanical support and thermal stability:
• UF 120LA: No-clean compatible underfill, eliminating the need for post-assembly cleaning
• UF 88UL: Designed for thermal cycling endurance in fine-pitch and large-area applications
• UF 158A2 & UF 158HA: Deliver superior moisture protection and strong adhesion
Die Attach Adhesives: Optimize heat dissipation and mechanical bonding:
• DA 90: A silver-filled, fast-curing, solvent-free adhesive
• TM 150E / TM 150EB: Solderable conductive adhesives with self-leveling and self-filling properties
• TM 158D: Diamond-filled for exceptional thermal conductivity
Wafer Level Materials: Pushing the limits of semiconductor integration:
• WL 125: A pre-applied underfill for chip-to-chip and wafer-to-wafer packaging
Optoelectronic Materials: Engineered for advanced optical-electrical applications:
• LEN 66AL: A robust underfill solution tailored for cutting-edge optoelectronic devices
Thermal Interface Materials: Maintain thermal performance under pressure:
• TM 158 / TM 150E / TGP 110: High-performance adhesives designed to enhance thermal management and device longevity
Experience the YINCAE Advantage
"SEMICON SEA is the premier platform to engage with the global electronics manufacturing community, and we are excited to present our newest innovations that continue to push the boundaries of what's possible," said Dr. Yin, CEO of YINCAE. "From high-reliability underfills to next-generation thermal materials, our products are engineered to solve today's challenges and support tomorrow's technologies."
Join us at Booth B2939 to meet with our team, explore our product, and discuss custom solutions tailored to your manufacturing needs. To schedule a meeting with our technical experts, please email info@yincae.com. We look forward to arranging a meeting at your convenience.
________________________________________
About YINCAE
YINCAE Advanced Materials, LLC is a leading U.S.-based manufacturer of high-performance adhesives and materials for the semiconductor and microelectronics industries. With a commitment to research, innovation, and customer success, YINCAE continues to develop technologies that improve process efficiency, reliability, and device performance.
For media inquiries, please contact:
Email: info@yincae.com
Phone: +1 (518) 452-2880
Website: www.yincae.com
YINCAE Advanced Materials, LLC
19 Walker Way, Albany, NY 12205 USA
Contact: Christine Hale
Tel: 518-452-2880
Email: info@yincae.com
YINCAE Advanced Materials, LLC is a global leader in developing, manufacturing, and supplying high-performance coatings, adhesives, and electronic materials. Based on the pillars of exceeding performance specifications, maximizing productivity, and lowering process costs, YINCAE consistently meets and exceeds customer expectations. Widely recognized in the micro-electronics industry, YINCAE provides advanced materials that enhance customer productivity and competitive position while supporting green initiatives. YINCAE is committed to facilitating smarter and faster production without sacrificing quality.
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