Semiconductor IC Design, Manufacturing, Packaging and Testing Market Share Driven by AI Computing, Mobility, and Advanced Node Innovation | Valuates Reports

Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size
The global market for Semiconductor IC Design, Manufacturing, Packaging and Testing was valued at US$ 835600 million in the year 2024 and is projected to reach a revised size of US$ 1199730 million by 2031, growing at a CAGR of 5.4% during the forecast period.

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The Semiconductor IC Design, Manufacturing, Packaging and Testing market continues to expand as global demand rises for advanced processing, memory, and connectivity solutions powering communication, computing, consumer electronics, automotive, and industrial systems. Market size growth is driven by rapid adoption of AI accelerators, high-performance computing platforms, 5G networks, and intelligent consumer devices. Market trends show increasing integration of advanced node technologies, system-level optimization, and heterogeneous integration, strengthening overall market growth across global semiconductor ecosystems.

In the type segment, IC design holds the largest market share as companies accelerate the development of processors, memory architectures, RF solutions, AI accelerators, and mixed-signal chips to meet rising performance requirements. IC manufacturing continues to record strong market growth supported by expanding wafer capacity, growing demand for advanced lithography, and increasing production of cutting-edge nodes. IC packaging and testing is growing rapidly as demand surges for advanced packaging formats, including 2.5D, 3D stacking, chiplets, and high-density system-in-package technologies. All three segments remain essential to ensuring performance, efficiency, and reliability across semiconductor supply chains.

On the application front, communication technologies lead the market share due to rising deployment of 5G, cloud connectivity, networking equipment, and mobile devices. The computer/PC segment also holds a significant share, driven by demand for high-performance CPUs, GPUs, memory modules, and data center components. The fastest market growth is observed in the automotive and industrial segments as electrification, autonomous systems, factory automation, and power electronics adoption accelerate. Consumer electronics and other applications continue to strengthen market growth with increasing use of smart devices, wearables, and imaging technologies.

The competitive landscape includes leading companies across the semiconductor value chain, such as Samsung, Intel, SK Hynix, Micron, Texas Instruments, STMicroelectronics, Kioxia, Sony Semiconductor Solutions, Infineon, NXP, Analog Devices, Renesas, Microchip Technology, onsemi, NVIDIA, Qualcomm, Broadcom, AMD, MediaTek, Marvell, Novatek, Tsinghua Unigroup, Realtek, OmniVision, MPS, Cirrus Logic, Socionext, LX Semicon, and HiSilicon. In manufacturing, companies such as TSMC, Samsung Foundry, GlobalFoundries, UMC, SMIC, Tower Semiconductor, PSMC, VIS, Hua Hong, and HLMC drive market share through advanced process technologies. Packaging and testing leaders including ASE, Amkor, JCET, TFME, PTI, HT-tech, KYEC, ChipMOS, SFA Semicon, Chipbond, UTAC, Carsem, Forehope Electronic, Unisem, and OSE support market growth through innovations in system integration, reliability testing, and high-density packaging. Equipment leaders such as ASML, Tokyo Electron, Lam Research, KLA, and Nikon form the backbone of advanced manufacturing capabilities.

Regionally, Asia-Pacific dominates the market share due to its extensive semiconductor manufacturing base, strong foundry presence, and leadership in consumer electronics, computing, and communication technologies. North America and Europe continue to contribute significantly to market growth, supported by advanced R&D, strong automotive and industrial demand, and leadership in semiconductor design. The Middle East, Latin America, and Southeast Asia are witnessing increased activity as governments strengthen semiconductor policies and supply-chain resilience. The market forecast points toward sustained market growth fueled by advanced node scaling, chiplet architectures, heterogeneous integration, and increasing global investment in semiconductor capacity and technological innovation.

Segment by Type

• IC Design
• IC Manufacturing
• IC Packaging & Testing

Segment by Application

• Communication
• Computer/PC
• Consumer
• Automotive
• Industrial
• Others

By Company

Samsung-Memory, Intel, SK Hynix, Micron Technology, Texas Instruments (TI), STMicroelectronics, Kioxia, Sony Semiconductor Solutions Corporation (SSS), Infineon, NXP, Analog Devices, Inc. (ADI), Renesas Electronics, Microchip Technology, Onsemi, NVIDIA, Qualcomm, Broadcom, Advanced Micro Devices, Inc. (AMD), MediaTek, Marvell Technology Group, Novatek Microelectronics Corp., Tsinghua Unigroup, Realtek Semiconductor Corporation, OmniVision Technology, Inc, Monolithic Power Systems, Inc. (MPS), Cirrus Logic, Inc., Socionext Inc., LX Semicon, HiSilicon Technologies, TSMC, Samsung Foundry, GlobalFoundries, United Microelectronics Corporation (UMC), SMIC, Tower Semiconductor, PSMC, VIS (Vanguard International Semiconductor), Hua Hong Semiconductor, HLMC, ASE (SPIL), Amkor, JCET (STATS ChipPAC), Tongfu Microelectronics (TFME), Powertech Technology Inc. (PTI), HT-tech, King Yuan Electronics Corp. (KYEC), ChipMOS TECHNOLOGIES, SFA Semicon, Chipbond Technology Corporation, UTAC, ASML, TEL (Tokyo Electron Ltd.), Lam Research, KLA, Nikon, Carsem, Forehope Electronic (Ningbo) Co.,Ltd., Unisem Group, OSE CORP.

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