Integrated Circuit Package Substrate Market Size, Competitor Ranking Analysis, Market Trend Forecast Report 2025-2031

On Aug 6, the latest report "Global Integrated Circuit Package Substrate Market 2025 by Manufacturers, Regions, Types and Applications, Forecast to 2031" from Global Info Research provides a detailed and comprehensive analysis of the global Integrated Circuit Package Substrate market. The report provides both quantitative and qualitative analysis by manufacturers, regions and countries, types and applications. As the market is constantly changing, this report explores market competition, supply and demand trends, and key factors that are causing many market demand changes. The report also provides company profiles and product examples of some of the competitors, as well as market share estimates for some of the leading players in 2025.

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According to our (Global Info Research) latest study, the global Integrated Circuit Package Substrate market size was valued at US$ 15170 million in 2024 and is forecast to a readjusted size of USD 27020 million by 2031 with a CAGR of 8.7% during review period.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
Integrated circuit package substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report is a detailed and comprehensive analysis for global Integrated Circuit Package Substrate market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.


This report also provides key insights about market drivers, restraints, opportunities, new product launches or approval.
Integrated Circuit Package Substrate market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type: FC-BGA、 FC-CSP、 WB BGA、 WB CSP、 Others
Market segment by Application: Smart Phones、 PC (Tablet, Laptop)、 Wearable Devices、 Others
Major players covered: Ibiden、 Kinsus、 Unimicron、 Shinko、 Semco、 Simmtech、 Nanya、 Kyocera、 LG Innotek、 AT&S、 ASE、 Daeduck、 Toppan Printing、 Shennan Circuit、 Zhen Ding Technology、 KCC (Korea Circuit Company)、 ACCESS、 Shenzhen Fastprint Circuit Tech、 TTM Technologies

The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Integrated Circuit Package Substrate product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Integrated Circuit Package Substrate, with price, sales quantity, revenue, and global market share of Integrated Circuit Package Substrate from 2020 to 2025.
Chapter 3, the Integrated Circuit Package Substrate competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Integrated Circuit Package Substrate breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment Integrated Circuit Package Substrate the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the Integrated Circuit Package Substrate sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2024.and Integrated Circuit Package Substrate market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Integrated Circuit Package Substrate.
Chapter 14 and 15, to describe Integrated Circuit Package Substrate sales channel, distributors, customers, research findings and conclusion.

The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Integrated Circuit Package Substrate
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace

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