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Flip Chip Global Market Report 2024 - Market Size, Trends, And Global Forecast 2024-2033 | 3M Company, Advanced Micro Devices Inc., Amkor Technology Inc., Apple Inc., Fujitsu Limited., Intel Corporation, International Business Machines Corporation, Samsun

Flip Chip Market Size

Flip Chip Market Size

As per the report, the flip chip market size has grown rapidly in recent years. It will grow from $34.9 billion in 2023 to $38.88 billion in 2024 at a compound annual growth rate (CAGR) of 11.4%. The flip chip market size is expected to see rapid growth in the next few years. It will grow to $60.48 billion in 2028 at a compound annual growth rate (CAGR) of 11.7%.

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Electronics Sales Surge Propelling Flip Chips Market Growth
The increase in sales of electronic products will propel the growth of the flip chips market during the forecast period. Flip chips are used in electronic equipment as it improves the presentation of portable electrical devices that operate at higher frequencies, allowing for greater use in ultrasonic and microwave operations. The technology exhibits high overall system efficiency and low inductance while taking up less space. According to Gartner, a US-based consulting firm estimated that the installed base of devices worldwide is expected to reach 6.4 billion units in 2022, an increase of 3.2% from 2021. Therefore, the increase in sales of electronic products drives growth in the flip chips market.

Innovative Technologies Propel Progress In The Flip Chip Market
Technological advancement is a key trend gaining popularity in the flip chip market. Companies in the flip chip market are focusing on developing technologies to strengthen their position in the market. For instance, In August 2021, ACM Research Inc., a US-based single-wafer wet cleaning equipment company, announced the launch of ACM's Ultra ECP GIII plating tool to support wafer-level packaging (WLP) including, product offers for silicon carbide (SiC), gallium nitride (GaN), and gallium arsenide for compound semiconductors (GaAs). The tool can plate gold (Au) into backside deep hole processes with uniformity and step coverage.

The flip chip market covered in this report is segmented -

1) By Packaging Technology: 3D IC, 2.5D IC, 2D IC
2) By Bumping Technology: Copper Pillar, Solder Bumping, Tin-Lead Eutectic Solder, Lead-Free Solder
3) By Industry: Electronics, Heavy Machinery and Equipment, IT and Telecommunication, Automotive, Other Industries

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Major companies operating in the flip chip market include 3M Company, Advanced Micro Devices Inc., Amkor Technology Inc., Apple Inc., Fujitsu Limited., Intel Corporation, International Business Machines Corporation, Samsung Electronics Co. Ltd., Texas Instruments Incorporated, ASE Technology Holding Co. Ltd., Chipbond Technology Corporation, Jiangsu Changjiang Electronics Technology Co. Ltd, Siliconware Precision Industries Co. Ltd., Unimicron Technology Corporation, Ibiden Co. Ltd., Nan Ya Printed Circuit Board Corporation, Shiko Electric Industries Co. Ltd., Austria Technologie & Systemtechnik AG, Kinsus Interconnect Technology Corporation, STATS ChipPAC Pte. Ltd., Powertech Technology Inc., UTAC Holdings Ltd, Taiwan Semiconductor Manufacturing Co., TF-AMD Microelectronics Sdn Bhd., Zhen Ding Technology Holding Ltd., Engent Inc., Masterwork Electronics, Advotech Company Inc., First Level Inc., Flipchip International LLC, Cormetech Inc., DCL International Inc.

Contents of the report:
1. Executive Summary
2. Flip Chip Market Report Structure
3. Flip Chip Market Trends And Strategies
4. Flip Chip Market - Macro Economic Scenario
5. Flip Chip Market Size And Growth
…..
27. Flip Chip Market Competitor Landscape And Company Profiles
28. Key Mergers And Acquisitions
29. Future Outlook and Potential Analysis
30. Appendix

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