Through Glass Vias(TGV) Substrate Market Revenue, Insights, Overview, Outlook, Analysis | Valuates Reports

Substrate market was valued at US$ 60 million in 2022 and is anticipated to reach US$ 480.5 million by 2029, witnessing a CAGR of 34.2% during the forecast period 2023-2029.

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The global Through Glass Vias(TGV) The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

At the regional level, the Chinese market has changed rapidly in the past few years, accounting for about 6% of the global market.

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In terms of product type and technology, 300 mm wafers have the largest market share, accounting for about 48% of the global market.

In terms of product market application, the consumer electronics industry is the largest, accounting for about 50% of the global market share.

TGV substrate market pattern is highly concentrated, most of the test products and technologies are mastered by foreign manufacturers, including Corning, LPKF, Samtec, KSO Wave Co., Ltd. And Tecnisco, etc.

Corning is the global leader in the TGV substrate industry, with a global market share of approximately 25%, and LPKF has a global market share of 19%.

Samtec has a 10% market share in the global TGV substrate market.

By Type
• 300 mm Wafer
• 200 mm Wafer
• Below 150 mm Wafer

By Application
• Consumer Electronics
• Automotive Industry
• Others

Key Players
Corning, LPKF, Samtec, KISO WAVE Co., Ltd., Tecnisco, Microplex, Plan Optik, NSG Group, Allvia

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