Press release
TGV (Through Glass Via) Foundry Market Revenue Share, Insights & Future Outlook
The global market for TGV (Through Glass Via) Foundry was valued at US$ 365 million in the year 2023 and is projected to reach a revised size of US$ 1224 million by 2030, growing at a CAGR of 18.9% during the forecast period.What is Driving the Growth of the TGV (Through Glass Via) Foundry Market?
North American market for TGV (Through Glass Via) Foundry is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
How Will Asia-Pacific and Consumer Electronics Applications Influence Market Expansion?
Asia-Pacific market for TGV (Through Glass Via) Foundry is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
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The global market for TGV (Through Glass Via) Foundry in Consumer Electronics is estimated to increase from $ million in 2023 to $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Which Companies Are Leading the TGV Foundry Market Worldwide?
The global key companies in the TGV (Through Glass Via) Foundry market include Corning, Samtec, Plan Optik, Vitrion (LPKF), WOP, E&R(鈦昇科技), Kiso Micro, 3D Glass Solutions, Nanosystems, NSC, NICHIWA KOGYO, Sky Semiconductor, Jiangxi Woge Optoelectronics, Chengdu Micro-Technology, Hubei W-OLF PHOTOELECTRIC Technology, Sai MicroElectronics, Zhejiang Lante Optics, Suzhou Senwan Electronics Technology, and Group Up Industrial.
Market Segmentation
By Type
• 300 mm
• 200 mm
By Application
• Consumer Electronics
• Automotive Industry
Key Companies in the Market
• Corning - Global leader in glass materials and advanced optics for electronics.
• Samtec - Specializes in high-performance interconnect solutions and packaging technologies.
• Plan Optik - Renowned for precision glass substrates and microstructuring technologies.
• Vitrion (LPKF) - Expert in laser-based glass processing and via drilling solutions.
• WOP - Provides advanced semiconductor packaging and optical glass solutions.
• E&R(鈦昇科技) - Focused on semiconductor equipment and TGV-related processing systems.
• Kiso Micro - Specializes in microfabrication and precision glass structuring.
• 3D Glass Solutions - Known for advanced glass-based microelectronics and RF packaging.
• Nanosystems - Offers innovative nano-structuring and microelectronics integration technologies.
• NSC - Manufacturer of specialty glass substrates for electronics and semiconductors.
• NICHIWA KOGYO - Expert in glass processing and micro-via manufacturing technologies.
• Sky Semiconductor - Provides semiconductor packaging services including through-glass vias.
• Jiangxi Woge Optoelectronics - Engaged in optoelectronic glass and advanced material processing.
• Chengdu Micro-Technology - Specializes in microfabrication for electronics and automotive applications.
• Hubei W-OLF PHOTOELECTRIC Technology - Develops optoelectronic materials and precision glass solutions.
• Sai MicroElectronics - Focused on MEMS, semiconductor, and microfabrication solutions.
• Zhejiang Lante Optics - Provides optical glass and precision component technologies.
• Suzhou Senwan Electronics Technology - Manufacturer of electronic packaging and glass substrate solutions.
• Group Up Industrial - Supplies advanced glass substrates and electronic material technologies.
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