Press release
Through Glass Via (TGV) Substrate Market Research Report 2024
Substrate market was valued at US$ 50 million in 2023 and is anticipated to reach US$ 238.4 million by 2030, witnessing a CAGR of 24.7% during the forecast period 2024-2030.A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). This report studies the TGV substrate (TGV wafer).
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Global Through Glass Via (TGV) Substrate key players include Corning, LPKF, Samtec, Kiso Micro Co.LTD, Tecnisco, etc. Global top five manufacturers hold a share about 70%. United States is the largest market, with a share about 40%, followed by Europe and Japan, both have a share over 49 percent. In terms of product, 300 mm is the largest segment, with a share over 67%. And in terms of application, the largest application is Consumer Electronics, followed by Automotive, etc.
This report aims to provide a comprehensive presentation of the global market for Through Glass Via (TGV) Substrate, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Through Glass Via (TGV) Substrate.
By Type
• 300 mm
• 200 mm
• Below 150 mm
By Application
• Biotechnology/Medical
• Consumer Electronics
• Automotive
Key Players
Corning, LPKF, Samtec, Kiso Micro Co.LTD, Tecnisco, Microplex, Plan Optik, NSG Group, Allvia
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