Near Field Communication Chips Market 2021 Strategic Assessment- NXP Semiconductors, Broadcom Corporation, Texas Instruments Inc, Qualcomm Inc, STMicroelectronics, MediaTek Inc

The report presents an in-depth assessment of the Near Field Communication Chips Market including enabling technologies, key trends, market drivers, challenges, standardization, regulatory landscape, deployment models, operator case studies, opportunities, future roadmap, value chain, ecosystem player profiles and strategies. The report also presents forecasts for Near Field Communication Chips from 2021 till 2027. The report covers the pre COVID-19 historic data, impact of COVID-19 and post-COVID-19 (Corona Virus) impact on various regions and major countries and on the future development of the industry is pointed out.

The global NFC market size was valued at $15,531 million in 2019, and is projected to reach $54,521 million by 2028, registering a CAGR of 14.8% from 2021 to 2028. 

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The report presents the market competitive landscape and a corresponding detailed analysis of the major vendor/key players in the market. Top Companies in the Global Near Field Communication Chips Market: NXP Semiconductors, Broadcom Corporation, Texas Instruments Inc, Qualcomm Inc, STMicroelectronics, MediaTek Inc, Mstar Semiconductor Inc, AMS AG, Sony Corporation, Marvell technology Group and others.

Recent Developments

In June2020, NXP Semiconductors, Mastercard, and Xiaomi Inc. announced they are bringing more convenient and secure contactless experiences to Russia as the first phase of a European-wide roll-out with NXP’s mobile wallet solution. Powering mobile payments for Xiaomi’s Mi Smart Band 4 NFC wearable devices, NXP’s mWallet 2GO supports an accelerated roll-out across Europe by addressing OEMs’ needs for easy yet secure and scalable, wallet implementations. It also addresses user demands to quickly enable payment devices by digitizing their bank cards and experience smooth NFC transactions at the Point-of-Sale.

In February 2019, NXP Semiconductors collaborated with FeliCa Networks, Inc. to strengthen the mobile payment and ticketing ecosystem as part of Japan’s preparation for worldwide events in the future. NXP’s new GlobalPlatform-based solution, PN81 series supports and integrates FeliCa, EMVCo, mobile transit MIFARE in a single solution to allow smartphones and other mobile devices to conveniently bridge mobile payments in Japan and across borders, and feature mobile ticketing, access control, and loyalty programs. The NXP PN81 series with FeliCa support features near field communication (NFC), embedded secure element (eSE) technology, and supports worldwide security standards such as GlobalPlatform to help unlock the potential of secure, seamless transaction and access use cases

In February 2018, NXP Semiconductors announced breakthroughs in GSMA-compliant eSIM solutions that radically make it easier for device manufacturers to bring consumers remote SIM provisioning and over-the-air updates with multiple Mobile Network Operator (MNO) subscriptions. The new NXP SN100U is the world’s first, single-die chipset featuring an embedded Secure Element (SE), Near Field Communications (NFC), and eSIM for added advanced functionality, cellular connectivity, and security.

In February 2018, NXP Semiconductors announced that Garmin International, Inc., a unit of Garmin Ltd., has chosen NXP’s PN80T embedded Secure Element (SE) and Near Field Communications (NFC) solution for the recently launched vívoactive three and Forerunner 645 Music featuring contactless payment capabilities. With NXP’s embedded Secure Element technology and innovative Loader Service provisioning solution, Garmin can easily and quickly deploy Garmin PayTM in their products without compromising security.

Market Overview:

Near field communication (NFC) is a short-range wireless connectivity technology that makes life convenient and easier for consumers across the globe by enabling simpler exchange of the digital content, transactions, and connection with different electronic devices. It is mainly used in smartphones, laptops, and tablets for short range of data exchange (up to 10 cm or less). This technology is used for marketing and payment applications; however, it is also being used in many other applications such as chip-enabled mobile marketing, ticketing, identity & access, and gaming.

Global Near Field Communication Chips Market Split by Product Type and Applications:

This report segments the global Near Field Communication Chips market on the basis of Types are:

Consumer Electronics

Automotive

Medical

Others

On the basis of Application, the Global Near Field Communication Chips market is segmented into:

64 Bytes

168 Bytes

Others

Regional Analysis For Near Field Communication Chips Market:

North America (The United States, Canada, and Mexico)
Europe (Germany, France, UK, Russia, and Italy)
Asia-Pacific (China, Japan, Korea, India, and Southeast Asia)
South America (Brazil, Argentina, Colombia, etc.)
The Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria, and South Africa)

Influence of the Near Field Communication Chips Market Report:
-Comprehensive assessment of all opportunities and risks in the Near Field Communication Chips market.
-The detailed study of business strategies for the growth of the Near Field Communication Chips market-leading players.
-Conclusive study about the growth plot of the Near Field Communication Chips market for forthcoming years.
-In-depth understanding of Near Field Communication Chips market-particular drivers, constraints, and major micro markets.
-Favorable impression inside vital technological and market latest trends striking the Near Field Communication Chips market.

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What are the market factors that are explained in the report?

-Key Strategic Developments: The study also includes the key strategic developments of the market, comprising R&D, new product launch, M&A, agreements, collaborations, partnerships, joint ventures, and regional growth of the leading competitors operating in the market on a global and regional scale.

-Key Market Features: The report evaluated key market features, including revenue, price, capacity, capacity utilization rate, gross, production, production rate, consumption, import/export, supply/demand, cost, market share, CAGR, and gross margin. In addition, the study offers a comprehensive study of the key market dynamics and their latest trends, along with pertinent market segments and sub-segments.

-Analytical Tools: The Global Near Field Communication Chips Market report includes the accurately studied and assessed data of the key industry players and their scope in the market by means of a number of analytical tools. The analytical tools such as Porter’s five forces analysis, SWOT analysis, feasibility study, and investment return analysis have been used to analyze the growth of the key players operating in the market.

The research includes historic data from 2015 to 2021 and forecasts until 2027 which makes the report an invaluable resource for industry executives, marketing, sales, and product managers, consultants, analysts, and stakeholders looking for key industry data in readily accessible documents with clearly presented tables and graphs.

Finally, the Near Field Communication Chips Market report is the believable source for gaining the market research that will exponentially accelerate your business. The report gives the principle locale, economic situations with the item value, benefit, limit, generation, supply, request and market development rate and figure and so on.

Customization of the Report: This report can be customized as per your needs for additional data up to 3 companies or countries or 40 analyst hours.

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