Press release
Safe inline X-Ray Inspection of BGA Solder Joints
OptiCon X-Line 3D
Initially, each BGA solder ball is localised in x/y-direction as well as z-direction. Subsequently, relevant parameters of each solder joint are determined in three layers. By comparing these measuring values open solder joints and wetting defects can de safely detected. Additionally, voids can be determined in size and their z-position within a solder joint. Naturally, the system is able to detect solder connections at IC pins and 2-pin components as well as THT components.
The OptiCon X-Line 3D is unrivalled worldwide by utilising the revolutionary GigaPixel technology. A real-time multi angle image recording is the basis that enables a test speed of 40cm²/s at full 3D PCB capturing. Integrated reconstruction methods, based on digital tomosynthesis, allows defined evaluation of the board’s single layers.
About GOEPEL electronic:
GOEPEL electronic is a worldwide leading vendor of professional JTAG/Boundary Scan solutions and technology innovator of IP based instrumentation. With more than 100 product launches the company became the biggest innovator in the market within the last five years. A network of branch offices, distributors and service partners ensures the global availability of the products as well as the support of the more than 7,000 system installations. Founded 1991 and headquartered in Jena, Germany, GOEPEL electronic employs currently about 170 employees and generated a revenue of about 21 Million Euro in 2010 (ca. $16.5 Mio). GOEPEL electronic’s products won several awards in recent years and are used by the leading companies in telecommunication, automotive, space and avionics, industrial controls, medical technology, and other industries. Further information about the company and its products can be found on the internet at www.goepel.com.
GOEPEL electronics Ltd.
Unit 1A
The Old Granary
Westwick, Cambridge
CB24 3AR/UK
Phone +44-1223-858298
Fax +44-1223-257800
www.goepel.co.uk
Stefan Meissner
press@goepel.com
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