Press Releases from SEPA EUROPE GmbH (1 total)
A more variable, smart chip cooler on the basis of an ultra-flat radial fan
Product innovation - Embedded World Trade Fair 2020
SEPA EUROPE has developed a powerful active cooler specially for compact designs. It is as small as a matchbox and has a thermal resistance of a mere 2.5 K/W. The ultra-flat radial fan can be combined with varying heat sinks for customized solutions. The product innovation will be presented for the first time at the Embedded World Trade Fair 2020.
Chip cooling with the…
