Significant Growth Foreseen by Die-Attach Materials Market During 2026

Increasing sales of consumer electronics continues to drive the demand for electrical circuit boards, wherein die-attach materials are key constituents. Growing proliferation of the electrification trend across industries has driven the sales of electrical components such as die-attach materials. However, in the face of the brimming demand, manufacturers of die-attach materials are facing challenges in extending their production capacities. The production of die-attach materials is becoming more complex as suppliers are finding difficulties in cost-effective procurement of raw materials.

According to Transparency Market Research’s recent report, the global die-attach materials market is anticipated to expand at a sluggish CAGR of 3.1% during the forecast period. By the end of 2026, the report has forecasted that the global die-attach materials market will reach US$ 970 Mn value. Leading manufacturers of die-attach materials have been profiled in the report, and they include, Creative Materials Inc., Dow Corning Corporation, Master Bond Inc., Henkel, Hybond Inc., AI Technology, and Alpha Assembly Solutions, among others. In the near future, a majority of players in the global die-attach materials market are expected to create new production techniques for lowering the overall manufacturing costs.

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APEJ – Largest Market for Die-Attach Materials

A regional analysis of the global die-attach materials landscape has been provided in the report. According to it, the Asia-Pacific excluding Japan (APEJ) region is expected to account for the largest share of the global die-attach materials market value throughout the forecast period. In actuality, the growth of the overall global die-attach materials market will be largely dependent on the APEJ region. Countries such as China (particularly Taiwan) and South Korea have emerged as leading producers of die-attach materials.

Industrial regulations in the APEJ countries are estimated to remain lucrative for mass-scale production of die-attach materials. In 2017, the APEJ die-attach materials market is expected to be worth half a billion dollars. The report also projects that by the end of the forecast period, nearly 70% of revenues procured in the global die-attach materials market will come from the APEJ region. Apart from the APEJ region, Japan is also expected to remain at the forefront of global die-attach materials market expansion. By the end of 2026, the tech-driven country will solely account for over US$ 100 Mn worth of revenues procured from the sales of die-attach materials. Japan’s die-attach materials market will also witness a considerable traction in terms of voluminous exports.

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Global Die-Attach Materials Market: Additional Forecast Highlights

In addition to the regional analysis, the study has segmented the global die-attach materials market on the basis of form, materials and products.

In 2017 and beyond, the demand for powdered die-attach materials is expected to plunge in the global market.

Through 2026, a majority of die-attach materials sold in the global semiconductor industry will be in the form of pastes.

The demand for die-attach materials in the form of wires will be relatively steady, compared to that of pastes.

Predominantly, polymer adhesives will witness more sales in the overall die-attach materials market, pertaining to their efficiency in providing adhesion to metal and plastic surfaces. In 2017, the global sales of polymer adhesive die-attach materials is estimated to bring in over US$ 200 Mn in revenues.

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Throughout the forecast period, die-attach films will be the top-selling products in the global die-attach materials market. Sintering products, on the other hand, will register a sluggish CAGR of 2.4% during the forecast period.

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This release was published on openPR.