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Flip Chip Technology Market - Key Trends, Applications & Future Opportunities
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To obtain the integration of diverse chips 2.5D IC packaging technology and 3D IC packaging technology are becoming the typical trend these days. Consumer electronics market holds the largest market share for flip chip technology market and it is expected to grow at highest rate. Flip chip technology market is further driven by its application in automotive market and it is expected to grow at higher CAGR rate. Demand for raw materials has been significantly increased by the manufacturers producing new technologies for bumping process. This leads to the aggressive growth in this business among the raw material market players.
In terms of geography, the flip chip technology market has been divided in to five key regions including North America, Latin America, Europe, Asia-Pacific and Middle East & Africa. The global flip chip technology market is expected to register healthy CAGR during the forecast period. Asia-Pacific is anticipated to be the dominant market for flip chip technology market followed by North America and Europe. The flip chip technologymarket in Asia-Pacific region is expected to grow at highest CAGR over the forecast period. Countries like China and India are major manufacturing hubs and are likely to provide abundant opportunities for the growth of the flip chip technologies.
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Some of the key players in the global flip chip technology market are Amkor Technology Inc., Ase Group, Faraday Technology Corp., Flipchip International Llc, Gigpeak Inc., Globalfoundries Inc., Ibm Corp., Intel Corp etc.
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