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Flip-Chip Technologies Market 2018 Industry Trend and Forecast 2022

02-26-2018 05:31 AM CET | Business, Economy, Finances, Banking & Insurance

Press release from: WISE GUY RESEARCH CONSULTANTS PVT LTD

/ PR Agency: Wise Guy Research Consultants Pvt Ltd
Global Flip-Chip Technologies market

Global Flip-Chip Technologies market

Global Flip-Chip Technologies market is estimated at $25.89 billion in 2015 and is poised to reach $57.04 billion by 2022, growing at a Compound Annual Growth Rate (CAGR) of 11.94% during the forecast period. Flip chip is a key technology for advanced packaging of microelectronic circuits and other micro-devices. This technology is used to interconnect semiconductor IC with other ICs, peripheral circuits or substrate in efficient way by solving the heat transfer problem of semiconductor devices, improving performance at higher frequency and reducing the power consumption. Wide range of low-end and high-end electronic products, enhanced electrical performance and high interconnection density are the major factors favoring the market growth.

Try  sample report @https://www.wiseguyreports.com/sample-request/flip-chip-technologies-global-market-outlook-2015-2022 

Due to a global trend on banning the toxic material lead in electronic products, conventional flip chip assembly using lead-based solder bumps is facing a great challenge. Flip chip technology continues to advance and is playing a huge role in 2.5D interposers and 3DICs. The demand for copper pillars and microbumps are reshaping the Flip chip technology, which are swiftly becoming the innovative conventional bumping metallurgy solutions for die interconnections. Intel is the leading producer of flip chip. It is estimated that, by the year 2017 more than half of all bumped wafers for flip chips will be made with copper pillars.
Some of the key players in the global market include IBM Corp., Samsung Electronics Co. Ltd., Texas Instruments Inc., Amkor Technology Inc., Intel Corp., Taiwan Semiconductor Manufacturing Co., Global Foundries U.S. Inc., Powertech Technology Inc. and Advanced Semiconductor Engineering Inc, Nepes Pte. Ltd., Stmicroelectronics NV (STM) and Stats Chippac Ltd.

Wafer Bumping Process Covered: 
• Copper (Cu) pillar 
• Tin-lead eutectic solder 
• Lead free solder 
• Gold stud and plated 
End Use Covered: 
• Medical devices 
• Industrial applications 
• Robotics 
• Smartphones 
• Desktop CPUs 
• Laptops 
• Automotive 
• GPUs and chipsets 
• Smart technologies 
• Other computing devices 
Applications Covered: 
• Memory 
• 2D logic system-on-a-chip (SoC) 
• Imaging 
• High-brightness light-emitting diode (HB-LED) 
• RF, power and Analog ICs 
• 2.5D/3D system-in-package/system-on-a-chip (SiP/SoC) 

What our report offers: 
- Market share assessments for the regional and country level segments 
- Market share analysis of the top industry players 
- Strategic recommendations for the new entrants 
- Market forecasts for a minimum of 7 years of all the mentioned segments, sub segments and the regional markets 
- Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations) 
- Strategic recommendations in key business segments based on the market estimations 
- Competitive landscaping mapping the key common trends 
- Company profiling with detailed strategies, financials, and recent developments 
- Supply chain trends mapping the latest technological advancements

Complete report details @ https://www.wiseguyreports.com/reports/flip-chip-technologies-global-market-outlook-2015-2022 

Table of content 
1 Executive Summary 

2 Preface 
2.1 Abstract 
2.2 Stake Holders 
2.3 Research Scope 
2.4 Research Methodology 
2.4.1 Data Mining 
2.4.2 Data Analysis 
2.4.3 Data Validation 
2.4.4 Research Approach 
2.5 Research Sources 
2.5.1 Primary Research Sources 
2.5.2 Secondary Research Sources 
2.5.3 Assumptions 

3 Market Trend Analysis 
3.1 Introduction 
3.2 Drivers 
3.3 Restraints 
3.4 Opportunities 
3.5 Threats 
3.6 Product Analysis 
3.7 Application Analysis 
3.8 Emerging Markets 

4 Porters Five Force Analysis 
4.1 Bargaining power of suppliers 
4.2 Bargaining power of buyers 
4.3 Threat of substitutes 
4.4 Threat of new entrants 
4.5 Competitive rivalry 

5 Global Flip-Chip Technologies Market, By Wafer Bumping Process 
5.1 Introduction 
5.2 Copper (Cu) pillar 
5.3 Tin-lead eutectic solder 
5.4 Lead free solder 
5.5 Gold stud and plated 

 About Us

Wise Guy Reports is part of the Wise Guy Consultants Pvt. Ltd. and offers premium progressive statistical surveying, market research reports, analysis & forecast data for industries and governments around the globe. Wise Guy Reports understand how essential statistical surveying information is for your organization or association. Therefore, we have associated with the top publishers and research firms all specialized in specific domains, ensuring you will receive the most reliable and up to date research data available.

Contact Us:

Norah Trent

+1 646 845 9349 / +44 208 133 9349

Follow on LinkedIn: https://www.linkedin.com/company/wise-guy-research-consultants-pvt-ltd-?trk=biz-companies-cym

Wise Guy Reports Is Part Of The Wise Guy Consultants Pvt. Ltd. And Offers Premium Progressive Statistical Surveying, Market Research Reports, Analysis & Forecast Data For Industries And Governments Around The Globe. Wise Guy Reports Features An Exhaustive List Of Market Research Reports From Hundreds Of Publishers Worldwide. We Boast A Database Spanning Virtually Every Market Category And An Even More Comprehensive Collection Of Market Research Reports Under These Categories And Sub-Categories.

Wise Guy Research Consultants Pvt Ltd
Pune – 411028
Maharashtra,
Ph: +91 841 198 5042
https://www.wiseguyreports.com

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