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Rugged IC Market: Market Segmentation from the Standpoint of Both Value And Volume
Moreover, rugged IC’s are configured with custom drivers, hardware and software, helping them to tolerate extreme environmental testing.
Integrated circuits are of three types- analog integrated circuits, digital integrated circuits, and mixed integrated circuits. Digital integrated circuits are used in computers, microprocessors, digital signal processors and other frequency counters, specially designed by utilizing various digital logic gates and other electronic components of circuits. Analog integrated circuits can be linear or RF IC’s, usually found in an operational amplifier that possesses a very high voltage gain.
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The integrated circuit market is highly prominent and is unquestionably expected to rise due to its dynamic application base. Integrated circuits are preferred because of their small size, lower cost of production, more reliability and low usage of energy. Restraints of integrated circuits include limited power rating, high grade of PNP, and the noise they produce during operation.
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The availability of rugged integrated circuits across geographies has expanded with a constant increase in the market size. Regions that prefer using this electronic device include North America, Europe, Asia Pacific, Latin America, and Middle East and Africa. There is an expected transmission of massive amounts of data in harsh environments, making rugged integrated circuits necessary in those fields. North America and Europe are early adopters of new technology and hence expected to witness steady growth during the forecast period.
The global market of rugged IC’s have several dominant and emerging players. The leading players involved in manufacturing rugged integrated circuits include Ozic (Arizona, U.S), Qualcomm Inc. (California, U.S), Analog Devices Inc. (Massachusetts, U.S), NXP Semiconductors (Netherlands), Maxim Integrated Products Inc. (California, U.S), Texas Instruments Inc. (Texas, U.S), STMicroelectronics NV (Geneva, Switzerland), Infineon Technologies AG (Neubiberg, Germany), Richtek Technology Corporation (Taiwan), General Dynamics Corporation (Virginia, United States), Crystal Group Inc. (Hiawatha, United States), DT Research Inc. (California, United States), Global Mixed-mode Technology Inc.(Taiwan), and Taiwan Semiconductor (Hsinchu, Taiwan).
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