SMSC Delivers Industry First Automotive USB 2.0 Hub Controller and Card Reader Combination Devices

TrueAuto(tm) Devices Meet Stringent Automotive Reliability Standards and Enable Access to Entertainment and Navigation Content via Memory Cards

Hauppauge, NY, May 27, 2009 - SMSC (NASDAQ: SMSC), a leading semiconductor company that provides Smart Mixed-Signal Connectivity(tm) solutions, today announced the USB82640 and USB82660 single-chip, 2-port USB 2.0 hub controllers combined with memory card reader functionality, allowing customers to access navigation data and entertainment content stored directly on solid state memory cards. The introduction of these integrated connectivity devices marks the expansion of SMSC's portfolio of TrueAuto(tm) solutions that are designed, fabricated, tested, characterized, qualified and supported specifically for use in highly reliable automotive applications.

"Portable memory cards are used by passengers to transfer information created on computers, portable media players or cameras into the car. Solid state memory is also increasingly replacing rotating media inside automotive infotainment devices like navigation systems to store content such as map data. These in-box use cases require true automotive-grade reliability," said Christian Thiel, Vice President and General Manager of SMSC's Automotive Information Systems group. "Our new combination hub and card reader devices, designed with our TrueAuto quality process, give car makers the ability to design highly reliable data access devices for their information and entertainment systems, whether those devices connect to internal peripherals or provide external consumer access."

The USB82640 provides two downstream USB 2.0 ports plus a single Secure Digital(tm) (SD)/MultimediaCard(tm) (MMC) or Sony MemoryStick(tm) memory card interface. The USB82660 provides a second SD card interface and is capable of operating up to an ambient temperature of 105 degrees Celsius. The second memory card interface enables navigation data and entertainment content to be accessed simultaneously when stored in popular memory card formats. The SDIO interface can be used to attach modules that provide additional features such as WiFi, Bluetooth(r) and GPS connections. Car makers can build complex automotive systems with confidence because the quality that the TrueAuto approach delivers ensures that both internal and external connections are highly reliable. Both products are high-performance, low-power, small footprint controller ICs. Additional advanced features include:

- PortMap to enable flexible port mapping and port disable sequences so that a single part can be used in multiple platforms that require 2, 3 or 4 USB ports.
- PortSwap to ease PCB design by aligning signal traces directly to connectors.
- PHYBoost to allow for programmable transceiver drive strength to aid in preserving signal integrity in complex system environments.

About TrueAuto:
TrueAuto is SMSC's automotive quality process. It has proven its capability to deliver leading edge quality and services to fulfill the needs of even the most demanding automotive customers. If integrated circuits ("ICs") that have been designed for consumer applications are intended for use in automotive applications, they are usually qualified according to the Automotive Electronics Council's (AEC-Q100) qualification requirements. AEC-Q100 however, just covers minimum common requirements for the qualification of an automotive IC. Many car companies and tier one automotive suppliers require extensive additional qualification tests, as AEC-Q100 alone does not lead to the ultra low defect rates that they require. In addition, AEC-Q100 primarily focuses on the qualification phase of the product cycle of an IC. Other phases such as the design and production of the IC, customer support and the handling and investigation of returns are not covered in detail. In order to reach the automotive goal of near zero defect rates, all phases of the IC product cycle need to be addressed thoroughly.

TrueAuto is SMSC's proven total approach to true automotive-grade quality. TrueAuto robustness begins with SMSC's design for reliability techniques within the silicon IC itself. Automotive-grade excellence and testability are designed into the IC. The IC is fully characterized over many operating parameters to prove the quality of the design under various conditions. Also, product qualification is focused on the most demanding customer expectations. It meets or exceeds automotive reliability standards and customer specific requirements. SMSC's TrueAuto approach goes far beyond the stress tests prescribed by the AEC-Q100 specifications. In addition, extensive technologies and processes, such as enhanced monitors are used in fabrication of TrueAuto products in order to continuously drive improvements in accordance with SMSC's zero Defects per Million (DPM) goals.

Availability:
Samples of the USB82640 and USB82660 are available today.

About SMSC:
Many of the world's most successful global technology companies rely upon SMSC as a go-to resource for semiconductor system solutions that span analog, digital and mixed-signal technologies. Leveraging substantial intellectual property, integration expertise and a comprehensive global infrastructure, SMSC solves design challenges and delivers performance, space, cost and time-to-market advantages to its customers. SMSC's application focus targets key vertical markets including consumer electronics, automotive, PC and industrial applications. The Company has developed leadership positions in its select markets by providing application specific solutions such as mixed-signal embedded controllers, non-PCI Ethernet, ARCNET, MOST(r) and Hi-Speed USB.

SMSC is headquartered in Hauppauge, New York with operations in North America, Asia and Europe. Engineering design centers are located in Arizona, New York, Texas and Karlsruhe, Germany. Additional information is available at www.smsc.com.

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Forward Looking Statements:
Except for historical information contained herein, the matters discussed in this announcement are forward-looking statements about expected future events and financial and operating results that involve risks and uncertainties. These uncertainties may cause our actual future results to be materially different from those discussed in forward-looking statements. Our risks and uncertainties include the timely development and market acceptance of new products; the impact of competitive products and pricing; our ability to procure capacity from our suppliers and the timely performance of their obligations, commodity prices, interest rates and foreign exchange, potential investment losses as a result of liquidity conditions, the effects of changing economic and political conditions in the market domestically and internationally and on our customers; our relationships with and dependence on customers and growth rates in the personal computer, consumer electronics and embedded and automotive markets and within our sales channel; changes in customer order patterns, including order cancellations or reduced bookings; the effects of tariff, import and currency regulation; potential or actual litigation; and excess or obsolete inventory and variations in inventory valuation, among others. In addition, SMSC competes in the semiconductor industry, which has historically been characterized by intense competition, rapid technological change, cyclical market patterns, price erosion and periods of mismatched supply and demand.

Our forward looking statements are qualified in their entirety by the inherent risks and uncertainties surrounding future expectations and may not reflect the potential impact of any future acquisitions, mergers or divestitures. All forward-looking statements speak only as of the date hereof and are based upon the information available to SMSC at this time. Such statements are subject to change, and the Company does not undertake to update such statements, except to the extent required under applicable law and regulation. These and other risks and uncertainties, including potential liability resulting from pending or future litigation, are detailed from time to time in the Company's reports filed with the SEC. Investors are advised to read the Company's Annual Report on Form 10-K and quarterly reports on Form 10-Q filed with the Securities and Exchange Commission, particularly those sections entitled "Other Factors That May Affect Future Operating Results" or "Risk Factors" for a more complete discussion of these and other risks and uncertainties.

SMSC and MOST are registered trademarks and Smart Mixed-Signal Connectivity and TrueAuto are trademarks of Standard Microsystems Corporation. Product names and company names are trademarks of their respective holders.

Media Contact:

SMSC Automotive Information Systems
Rolf Hoffmeyer-Zlotnik
T +49 721 625 37 224
E Rolf.Hoffmeyer-Zlotnik(at)smsc.com
W www.smsc.com

hueggenberg gbr
Mandy Ahlendorf
T +49 8151 55 50 09 11
E presse(at)hueggenberg.com

This release was published on openPR.