Press release
Multilayer Printed-wiring Board Market Report for Period 2017 till 2022 Samsung Electro-Mechanics, LG Innotek, AT&S, Meiko, Young Poong Group, Daeduck Group, Nanya PCB, Zhen Ding Technology, Unimicron, Ibiden and Others
Multilayer Printed-wiring Board Market
Multilayer printed-wiring boards are made from the same base material with copper foil on the top & bottom and one or moreinner layercores. The number of layers corresponds to the number of copper foil layers.
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Top Company Profiles and Analysis included in this report:
Nippon Mektron
Zhen Ding Technology
Unimicron
Young Poong Group
Samsung Electro-Mechanics
Ibiden
Tripod
TTM Technologies
Sumitomo Electric SEI
Daeduck Group
Nanya PCB
Compeq
HannStar Board
LG Innotek
AT&S
Meiko
Chin-Poon
Shennan
Others
Global Multilayer Printed-wiring Board Market: Key Product Type
Layer 4~6
Layer 8~10
Layer 10+
Others
Global Multilayer Printed-wiring Board Market: Key Application Type
Consumer electronics
Communications
Computer related industry
Automotive industry
Others
Global Multilayer Printed-wiring Board Market: Key Region
North America (USA, Canada and Mexico)
Europe (Germany, France, UK, Russia, Italy and Others)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia and Others)
South America (Brazil, Argentina, Columbia and Others)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria, South Africa and Others)
The Global Multilayer Printed-wiring Board Market analysis report provides detailed value chain for analysis of Global Multilayer Printed-wiring Board Market. The value chain helps to analyze major upstream in raw materials, major equipment’s, manufacturing process, downstream customer analysis and major distributor analysis.
The report also covers in-depth description, competitive scenario, wide product portfolio of prime players active in this market and business strategies adopted by competitors along with their SWOT analysis. Side by side, it also explicitly provides information about mergers, acquisitions, joint ventures, and all the other important activities happened in current and past few years. The Global Multilayer Printed-wiring Board Market report explores manufacturer’s competitive scenario and provides market share for all major players of this market based on production capacity, sales, revenue, geographical presence and other major factors.
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Table of Contents:
1 Market Overview
1.1 Market Segment Overview
1.1.1 Product Definition
1.1.2 Market by Type
1.1.2.1 Layer 4~6
1.1.2.2 Layer 8~10
1.1.2.3 Layer 10+
1.1.3 Market by Application
1.1.3.1 Consumer electronics
1.1.3.2 Communications........................Continue (https://goo.gl/VC57Hi)
Global Multilayer Printed-wiring Board Market Research Industry Report is prepared with the help of extensive primary and secondary sources, directories, journals, newsletters and with the help of third-party application like Hoovers, Factiva, Bloomberg, Businessweek, etc.
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