openPR Logo
Press release

SparkLAN Launches WNSQ-261ACN(BT) 802.11ac/a/b/g/n with MU-MIMO Wi-Fi +Bluetooth 4.1 Combo M.2 LGA Type Module

05-11-2017 10:54 AM CET | Industry, Real Estate & Construction

Press release from: SparkLAN Communications, Inc

SparkLAN Launches WNSQ-261ACN(BT) 802.11ac/a/b/g/n with

SparkLAN Communications, Inc., a broadband wireless networking solution provider ships the wireless 802.11ac/a/b/g/n Dual-Band (2.4GHz / 5GHz) M.2 Card that combines Bluetooth , adopt LGA (Land grid array) packaging technology.

SparkLAN WNSQ-261ACN(BT) 802.11ac/a/b/g/n Dual-Band WiFi + bluetooth M.2 LGA type 1216 module based on Qualcomm Atheros QCA6174A-5 chipset. Use LGA package technology gives the advantage of low cost small size , thinner and lighter , is also flexibility for higher performance and better system scaling.

WNSQ-261ACN(BT) is Dual-Band AC on 2.4GHz and 5GHz and incorporates the latest Bluetooth 4.1 , adopting the latest 802.11ac solutions with MU-MIMO (multi-user multi-input/multi-output) technology that provides high performance Wi-Fi connectivity and delivers higher bandwidth to more devices simultaneously. The download speed are 300Mbps on N networks and 867Mbps on AC network.

WNSQ-261ACN(BT) supports 1T1R with RX diversity (Support Wi-Fi/BT co-existence) technology, which runs up to 433Mbps and 1~3Mbps EDR for BT. In addition, supports 20/40/80MHz and 256-QAM to maximize bandwidth efficiency and suit for Wi-Fi applications requiring robust Wi-Fi link and Bluetooth transmission.

Adopting the latest 802.11ac solution WNSQ-261ACN(BT) is ideal for next-generation high throughput enterprise networking solution. Incorporated with advanced security encryption, such as WEP, WPA, WPA2, WPS, and 802.1x, it helps prevent user’s devices from malicious attacks.

Use LGA technology, WNSQ-261ACN(BT) is well suited for embedded applications, include medical devices, security systems, PoS, digital signs, gaming machine, tablet PC’s, handheld devices, thin client devices, and gaming machine, notebook computer, etc.

Key Feature:
● Qualcomm Atheros QCA6174A-5
● Form Factor: M.2 LGA TYPE 1216
● Interface: PCIe: WLAN ; USB: Bluetooth
● Antenna: 2x IPEX MHF4 connectors, 2T2R
● BT transmission speed including 1M, 2M and 3Mbps EDR operations
● Supports for Simple Pairing (SP) and Enhanced Inquiry Response (EIR) function
● HCI USB interface to work with Windows upper layer stack
● Support MU-MIMO
● Wi-Fi Supports Low Power PCIe (w/ L1 substate) interfaces
● Two-stream spatial multiplexing up to 867Mbps data rate
● Support: Windows 7/8.1/10

Founded in 2002, SparkLAN is one of the worldwide leading wireless networking solution providers. Our product mix covers wireless embedded modules, and wireless networking devices, offering a comprehensive line of solutions for M2M connectivity in the highest growing broadband communication application. For more information, please visit

8F.,No.257,Sec.2,Tiding-Blvd.,Neihu District,Taipei City 11493,Taiwan

This release was published on openPR.

Permanent link to this press release:

Please set a link in the press area of your homepage to this press release on openPR. openPR disclaims liability for any content contained in this release.

You can edit or delete your press release SparkLAN Launches WNSQ-261ACN(BT) 802.11ac/a/b/g/n with MU-MIMO Wi-Fi +Bluetooth 4.1 Combo M.2 LGA Type Module here

News-ID: 532537 • Views:

More Releases from SparkLAN Communications, Inc

M.2 SDIO First Product Line
M.2 SDIO First Product Line
The WNFB-266AXI (BT) is a WLAN 802.11ax (WiFi 6) SDIO M.2 2230 (KEY E) Module. With its increased capacity, better coverage, and connections, it allows you to work efficiently. Besides, it comes with an improved battery life of IoT sensors and an extended range of Wi-Fi signals. Implementing the new 802.11ax standard has its advantages and unique features like OFDMA, 1024QAM, Target Wake Time (TWT), and spatial reuse. This module
WiFi SiP module ready with Rockchip, Amlogic & Allwinner | SparkLAN
WiFi SiP module ready with Rockchip, Amlogic & Allwinner | SparkLAN
SparkLAN introduce wifi sip module product family designed for ultra small and easy integration , have ready with CPU Rockchip , Amlogic, Allwinner, and application for various fields. A selection of our solutions Internet of Things Internet of Things uses sensor technologies to acquire information, such as the status, location, and properties of the physical world Increasing number of traditional management models has made breakthroughs based on the combination of new technologies. Experience
SparkLAN will Launch WiFi SiP Module for Embedded IoT Applications with Broadcom Solution
SparkLAN will Launch WiFi SiP Module for Embedded IoT Applications with Broadcom …
Sparklan is going to launch SiP module (with size 12x12mm, 13x15mm) for embedded IoT applications which can be applied on a tablet, OTT box, portable devices, and home security products. SiP module is utilized Broadcom WiFi solutions. SparkLAN provides unmatched connectivity solutions for the Internet of Things. Its 802.11ac chips offer the fastest and most power-efficient consumer download experiences with more robust and more reliable connections. Broadcom Combo solution (802.11ac, Dual-Band
Best M.2 WiFi Module Series | SparkLAN
Best M.2 WiFi Module Series | SparkLAN
Swift, reliable connectivity is gateway to the World Wide Web. With an M.2 wifi card, can get more extensive coverage on multiple platforms in less time than standard wireless connections. Taipei, Taiwan,2019-07-15 - / PressReleasePoint / - Have a stable, consistent and reliable wireless connection? If often annoyed by constant dropouts, weak signals or slow connectivity, then an M.2 Wi-Fi card may be the answer. Swift, reliable connectivity is gateway to

All 4 Releases

More Releases for LGA

IoT Smart Modules Market Future Developments, Industry Revenue and Competitive L …
The IoT Smart Modules research report is the professional report with the premium insights which includes the size of the business, the ongoing patterns, drivers, dangers, conceivable outcomes and primary segments. The Market Report predicts the future progress of the IoT Smart Modules market based on accurate estimations. Furthermore, the report offers actionable insights into the future growth of the market based on inputs from industry experts to help readers
Flip Chip Technology Market Report 2018: Segmentation by Wafer Bumping Process ( …
Global Flip Chip Technology market research report provides company profile for Samsung (South Korea), Intel (U.S.), GlobalFoundries (U.S.), UMC (Taiwan), ASE, Inc. (Taiwan), Amkor Technology (U.S.), STATS ChipPAC (Singapore), Powertech Technology (Taiwan), STMicroelectronics (Switzerland) and Others. This market study includes data about consumer perspective, comprehensive analysis, statistics, market share, company performances (Stocks), historical analysis 2012 to 2017, market forecast 2018 to 2025 in terms of volume, revenue, YOY growth rate,
Major sales success for Donauer Solartechnik
LGA structural type analysis – Over 2.5 MWp already sold for commercial buildings Gilching, 09 August 2012. Thanks to LGA certification via type testing/structural type analysis of the Donauer Flat Roof and Flat Roof Duplex mounting frames by the LGA Test Office for Structural Analysis, Donauer Solartechnik has already achieved sales of 2.5 MWp in the first half of 2012. "The LGA approval of the FISCHER Licht & Metall manufacturer is
Linear Technology| LTC2881-82: Isolated RS485 & RS232 µModule Transceivers
Isolated RS485 & RS232 µModule Transceivers Now Specified for -55°C to 105°C for Military & Automotive Applications MILPITAS, CA – March 26, 2012 – Linear Technology Corporation introduces automotive (H-grade) and high reliability military (MP-grade) versions of the LTM2881 and LTM2882, isolated µModule® transceivers which guard against large ground-to-ground differentials and common-mode transients in RS485 and RS232 networks. The LTM2881 single RS485 and LTM2882 dual RS232 transceivers break ground loops
Linear Technology: -55ºC to 125ºC Buck-Boost DC/DC uModule Regulator, up to 36 …
MILPITAS, CA – September 21, 2010 – Linear Technology Corporation introduces the LTM4609MP, a buck-boost DC/DC uModule® system-in-a-package that is guaranteed and tested for the wide -55ºC to 125ºC temperature range. The LTM4609MP is designed to deliver precision regulation in demanding environments in applications such as military, avionics, heavy industrial machinery, and harsh environment sensors. These uModule devices are backed by Linear Technology’s rigorous reliability and quality test standards
Linear Technology: 15A DC/DC uModule Regulator Delivers 50% More Power without S …
MILPITAS, CA – September 16, 2010 – Linear Technology Corporation introduces the LTM4627, a 15A DC/DC uModule® regulator with onboard inductors, MOSFETs and supporting components in a 2.6g, 15mm x 15mm LGA (land grid array) package. Circuit design enhancements lower gate capacitance MOSFETs and stronger MOSFET drivers enable the LTM4627 to operate at approximately 7% higher efficiency or to deliver up to 15A load current in the same board area