openPR Logo
Press release

WiFi SiP module ready with Rockchip, Amlogic & Allwinner | SparkLAN

09-08-2020 09:38 AM CET | Media & Telecommunications

Press release from: SparkLAN Communications, Inc

sip module

sip module

SparkLAN introduce wifi sip module product family designed for ultra small and easy integration , have ready with CPU Rockchip , Amlogic, Allwinner, and application for various fields.

A selection of our solutions

Internet of Things
Internet of Things uses sensor technologies to acquire information, such as the status, location, and properties of the physical world Increasing number of traditional management models has made breakthroughs based on the combination of new technologies.

Experience Sharing
CPU Rockchip RK3399 / Allwinner A64 Ready with WiFi SiP AP6256
CPU Rockchip RK3399 Ready with WiFi SiP AP6398S
CPU Allwinner H6 / Amlogic S905 / Amlogic S912 Ready with WiFi SiP AP6345SD

Set top box / 4K TV
The new generation smart STB is a multi-functional appliance integrating traditional broadcasting content, high-quality OTT content delivery, game console, local media playback and internet application.

Experience Sharing
CPU Rockchip RK3288 / RK3328 / Allwinner H6 Ready with WiFi SiP AP6256
CPU Rockchip RK3318 / RK3399 Ready with WiFi SiP AP6212SD
CPU Rockchip RK3399 Ready with WiFi SiP AP6275S
CPU Amlogic S912 Ready with WiFi SiP AP6398S
CPU Amlogic S922X Ready with WiFi SiP AP6738SD, WiFi SiP AP6356SDPB

Weighing Scale
Weighing Scales are highly reliable and provide your business with an effective means of achieving highly accurate readings of weight measurements for a variety of different applications.

Experience Sharing
CPU Rockchip RK3399 Ready with WiFi SiP AP6398S

Facial recognition / Camera
Facial recognition seems amazing it is completely independent in the identification process and It’s fast, accurate, and provides outstanding results in no time.

Experience Sharing
CPU Rockchip RK3399 / Allwinner A20 Ready with WiFi SiP AP6181
CPU Allwinner H6 Ready with WiFi SiP AP6256

8F.,No.257,Sec.2,Tiding-Blvd.,Neihu District,Taipei City 11493,Taiwan

About SparkLAN
SparkLAN is dedicated to design-in, marketing and sales of a top-quality wireless solution. Our product range includes commercial grade and Industrial grade wireless modules solution. We provide technical support, consultation, and module, from customer initial development phase right through to production and beyond. Short communication channels within our organization guarantee rapid and highly competent care and attention.

Working closely with our customers, SparkLAN is able to advise customers on the latest trends in technology as well as sharing product roadmaps. In addition to offering technical solutions, SparkLAN also keeps a close eye on prices and lead-times, ensuring the right modules are delivered to the right place at the right time. Our ability to include flexible customer-specific logistics is also a key strength of SparkLAN. http://www.sparklan.com

This release was published on openPR.

Permanent link to this press release:

Copy
Please set a link in the press area of your homepage to this press release on openPR. openPR disclaims liability for any content contained in this release.

You can edit or delete your press release WiFi SiP module ready with Rockchip, Amlogic & Allwinner | SparkLAN here

News-ID: 2129828 • Views:

More Releases from SparkLAN Communications, Inc

M.2 SDIO First Product Line
M.2 SDIO First Product Line
The WNFB-266AXI (BT) is a WLAN 802.11ax (WiFi 6) SDIO M.2 2230 (KEY E) Module. With its increased capacity, better coverage, and connections, it allows you to work efficiently. Besides, it comes with an improved battery life of IoT sensors and an extended range of Wi-Fi signals. Implementing the new 802.11ax standard has its advantages and unique features like OFDMA, 1024QAM, Target Wake Time (TWT), and spatial reuse. This module
SparkLAN will Launch WiFi SiP Module for Embedded IoT Applications with Broadcom Solution
SparkLAN will Launch WiFi SiP Module for Embedded IoT Applications with Broadcom …
Sparklan is going to launch SiP module (with size 12x12mm, 13x15mm) for embedded IoT applications which can be applied on a tablet, OTT box, portable devices, and home security products. SiP module is utilized Broadcom WiFi solutions. SparkLAN provides unmatched connectivity solutions for the Internet of Things. Its 802.11ac chips offer the fastest and most power-efficient consumer download experiences with more robust and more reliable connections. Broadcom Combo solution (802.11ac, Dual-Band
Best M.2 WiFi Module Series | SparkLAN
Best M.2 WiFi Module Series | SparkLAN
Swift, reliable connectivity is gateway to the World Wide Web. With an M.2 wifi card, can get more extensive coverage on multiple platforms in less time than standard wireless connections. Taipei, Taiwan,2019-07-15 - / PressReleasePoint / - Have a stable, consistent and reliable wireless connection? If often annoyed by constant dropouts, weak signals or slow connectivity, then an M.2 Wi-Fi card may be the answer. Swift, reliable connectivity is gateway to

All 4 Releases


More Releases for CPU

Dual-core CPU Modules Market 2022 | Detailed Report
The Dual-core CPU Modules research report combines vital data incorporating the competitive landscape, global, regional, and country-specific market size, market growth analysis, market share, recent developments, and market growth in segmentation. Furthermore, the Dual-core CPU Modules research report offers information and thoughtful facts like share, revenue, historical data, and global market share. It also highlights vital aspects like opportunities, driving, product scope, market overview, and driving force. Download FREE Sample Report
CPU Temperature Monitor Software Market 2021 Industry Status and Global Outlook …
The Global CPU Temperature Monitor Software Market provides a unique tool for evaluating the market, highlighting opportunities, and supporting strategic and tactical decision-making. This report recognizes that in this rapidly-evolving and competitive environment, up-to-date marketing information is essential to monitor performance and make critical decisions for growth and profitability. The report covers the post-COVID-19 (Corona Virus) impact on various regions and major countries and on the future development of the
CPU Heatsink Market Size, Share, Development by 2026
Market Research Report Store offers a latest published report on CPU Heatsink Market Analysis and Forecast 2019-2025 delivering key insights and providing a competitive advantage to clients through a detailed report. This study mainly helps understand which market segments or Region or Country they should focus in coming years to channelize their efforts and investments to maximize growth and profitability. The report presents the market competitive landscape and a consistent in
FastComet Introduces New Dedicated CPU Servers
San Francisco, CA, June 25, 2019 --(OpenPR.com)-- FastComet is a web hosting provider from San Francisco, California, that was established in 2013. After reinventing their whole brand identity earlier this year, FastComet is keeping up the pace, introducing the Dedicated CPU Servers. These Servers are backed by AMD EPYC 7501 processor, designed to meet the requirements of specific applications that can take advantage of the higher clock speeds. The Dedicated
United States CPU Processors Market Report 2017
Summary This report studies sales (consumption) of CPU Processors in United States market, focuses on the top players, with sales, price, revenue and market share for each player, covering Intel Toshiba Broadcom MediaTek Ineda Marvell NXP STMicroelectronics Market Segment by States, covering California Texas New York Florida Illinois Split by product types, with sales, revenue, price, market share and growth rate of each type, can be divided into Type I Type II Split by applications, this report focuses on sales, market share and growth rate of CPU Processors in
electronica 2010 shows milestones in CPU development
International semiconductor manufacturers present new virtualisation solutions and multicore architectures at the world’s leading trade fair in Munich. Munich, 30th September 2010. The topics of virtualisation and multicore are the central thread that runs through the electronica 2010 trade fair to be held from 9th to 12th November at the Munich Trade Fair Centre. Leading international semiconductor manufacturers will exhibit the latest single core and multicore processors with virtualisation support