Underfill Material Market: Booming Electronic Industry Fuels Uptake of Underfill Materials

Underfill materials are essentially composite formulations made out of inorganic fillers and organic polymers. These materials are used in semiconductor packaging for improving the thermo-mechanical performance. Underfill materials are being extensively used in semiconductor packaging due to their remarkable thermal stability and reworkability. According to the research report by Transparency Market Research, the global underfill material market is expected to be worth US$448.3 mn by the end of 2024 as compared to US$220.4 mn in 2015. Analysts predict that the global market will expand at a CAGR of 8.3% during the forecast period of 2016 and 2024.

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Capillary Underfill Materials to Exhibit Strong Growth through 2024

On the basis of application, the underfill materials market is segmented into flip chips, ball grid array, and chip scale packaging. Accounting for a 52.6% share in 2016, flip chips are estimated to take the lead throughout the forecast period. Based on product type, the global market for underfill materials is classified into capillary underfill material (CUF), no-flow underfill material (NUF), and molded underfill material (MUF). Among these, capillary underfill materials are projected to exhibit a high growth rate through 2024.

From a geographical viewpoint, the global underfill materials market is segmented into North America, Latin America, Asia Pacific, Europe, and the Middle East and Africa. Asia Pacific is forecast to witness tremendous growth, reporting a CAGR of 9.7% in terms of revenue from 2016 to 2024. The region is also projected to dominate the global market with a revenue share of 64.4% by the end of 2016.

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Growing Applications of Underfill Materials in Military and Aerospace

One of the most significant factors fueling the demand for underfill materials is the substantial demand for portable electronic equipment across most developed countries. “Consumers have been seeking lighter, more compact, and faster components for portable devices with high functionality and this is only achieved through the use of underfill materials,” the author of the report states. These materials not only boost the device’s thermal cycling resistance, but also provides impact resistance, strength, and improves its overall reliability. With the soaring demand for and usage of tablets and smartphones, the market for underfill materials is set to grow at a rapid pace.

The demand for underfill materials also stems from the automotive and military and aerospace sectors, TMR notes. Expanding budgets in the military and aerospace industry have given rise to the demand for portable electronics with greater functionality and the ability to withstand various forms of stress. In the automotive industry, underfill materials are used to improve the reliability of thermal cycling board levels and solder joints.

On the flip side, with end users seeking low-cost packaging solutions, the profit margins for underfill material suppliers is diminishing. This is threatening to hamper the growth of the global market. However, vendors across the supply chain are looking to collaborate with other players so as to maintain the momentum of the development of new and innovative materials.

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