Press release
Global Underfill Market by Manufacturers, Regions, Type and Application, Forecast to 2022
Underfill is used to fill space beneath a die and adhere to its carrier. They add structural strength, increase impact resistance, bolster thermal cycling resistance and improve overall reliability. Underfill can be found in a wide variety of applications including mobile phone, game console, computor, tablet PC and digital camera.
Scope of the Report:
This report focuses on the Underfill in Global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
Market Segment by Manufacturers, this report covers
Henkel
WON CHEMICAL
NAMICS
SUNSTAR
Hitachi Chemical
Fuji
Shin-Etsu Chemical
Bondline
AIM Solder
Zymet
Panacol-Elosol
Master Bond
DOVER
Darbond
HIGHTITE
U-bond
Market Segment by Regions, regional analysis covers
North America (USA, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America, Middle East and Africa
Market Segment by Type, covers
Semiconductor Underfills
Board Level Underfills
Market Segment by Applications, can be divided into
Industrial Electronics
Defense & Aerospace Electronics
Consumer Electronics (laptops, mobile phones, MP3 players, game consoles, digital cameras,etc.)
Automotive Electronics
Medical Electronics
There are 13 Chapters to deeply display the global Underfill market.
Chapter 1, to describe Underfill Introduction, product scope, market overview, market opportunities, market risk, market driving force;
Chapter 2, to analyze the top manufacturers of Underfill, with sales, revenue, and price of Underfill, in 2015 and 2016;
Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2015 and 2016;
Chapter 4, to show the global market by regions, with sales, revenue and market share of Underfill, for each region, from 2011 to 2016;
Chapter 5, 6, 7 and 8, to analyze the key regions, with sales, revenue and market share by key countries in these regions;
Chapter 9 and 10, to show the market by type and application, with sales market share and growth rate by type, application, from 2011 to 2016;
Chapter 11, Underfill market forecast, by regions, type and application, with sales and revenue, from 2016 to 2021;
Chapter 12 and 13, to describe Underfill sales channel, distributors, traders, dealers, appendix and data source.
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