Flip Chip Ball Grid Array (FCBGA) Market Set to Surge - Key Insights You Must Know

Flip Chip Ball Grid Array (FCBGA) - Market Size

The global market for Flip Chip Ball Grid Array (FCBGA) was estimated to be worth US$ 4369 million in 2023 and is forecast to a readjusted size of US$ 6448.7 million by 2030 with a CAGR of 5.6% during the forecast period 2024-2030

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Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.

This report aims to provide a comprehensive presentation of the global market for Flip Chip Ball Grid Array (FCBGA), focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Flip Chip Ball Grid Array (FCBGA) by region & country, by Type, and by Application.

By Type
• Below 8 Layer
• 8-20 Layer

By Application
• CPU
• ASIC
• GPU

Key Companies
Unimicron, Ibiden, Samsung Electro-Mechanics, Amkor Technology, Fujitsu, TOPPAN INC, Shinko Electric, Nan Ya PCB Corporation, AT&S, Daeduck Electronics, Kinsus Interconnect Technology, Zdtco, KYOCERA, NCAP China

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