Press release
WSEELASER - Leading Innovator in Optical Communication and Fiber Sensing
Core Product Portfolio1. Fiber Amplifier Series (EDFA / EYDFA)
WSEELASER's amplifier series covers a full range of applications:
*
Mini Edfa [https://www.wseelink.com/mini-edfa/]: Compact, low power consumption, ultra-low noise;
*
Dwdm Edfa [https://www.wseelink.com/dwdm-edfa/] (C / C+L Band) for DWDM networks;
*
Pm Edfa [https://www.wseelink.com/pm-edfa/] for polarization-maintaining systems;
*
EYDFA: Erbium-Ytterbium co-doped amplifier up to 10W output power;
*
Rack-Mount EDFA Subsystems with APC/ACC modes, LCD interface, and remote monitoring.
These amplifiers are widely used in optical communication, fiber sensing, network repeater, and research testing fields.
2. Optical Sources & Components
Main categories include:
*
Narrow Linewidth Laser, ASE Source (C/C+L Band), and High Stability Optical Source.
*
Optical devices such as collimators, splitters, and polarization-maintaining components.
*
Mini (2+1) right 1 Collimator and modular optical subsystems designed for integration and system-level deployment.
3. OEM / ODM Customization Service
WSEELASER offers flexible customization including:
*
Optical, electrical, and mechanical design;
*
Hardware/software interface customization;
*
Firmware and communication protocol development;
*
Specialized testing and fixture design.
This approach ensures each solution perfectly fits customer applications.
Manufacturing & R&D Capability
With a 7,500 modern factory, precision instruments, and a skilled R&D team, WSEELASER guarantees high product reliability, consistent optical performance, and international-level quality assurance.
Global Network & Market Expansion
WSEELASER products are exported to over 100 countries, serving partners in the U.S., Germany, India, Russia, Brazil, UAE, and South Korea.The company actively develops new-generation fiber sensing (DAS/DVS) and intelligent optical communication technologies to empower the global photonics market.
Recent launches include:
*
10W EYDFA high-power amplifier
*
24dBm C+L band EDFA module
*
Modular optical subsystem for DWDM applications
Media Contact
Company Name: Shandong Wanshuo Optoelectronic Equipment Co., Ltd.
Email:Send Email [https://www.abnewswire.com/email_contact_us.php?pr=wseelaser-leading-innovator-in-optical-communication-and-fiber-sensing]
Country: China
Website: https://www.wseelink.com/
Legal Disclaimer: Information contained on this page is provided by an independent third-party content provider. ABNewswire makes no warranties or responsibility or liability for the accuracy, content, images, videos, licenses, completeness, legality, or reliability of the information contained in this article. If you are affiliated with this article or have any complaints or copyright issues related to this article and would like it to be removed, please contact retract@swscontact.com
This release was published on openPR.
Permanent link to this press release:
Copy
Please set a link in the press area of your homepage to this press release on openPR. openPR disclaims liability for any content contained in this release.
You can edit or delete your press release WSEELASER - Leading Innovator in Optical Communication and Fiber Sensing here
News-ID: 4339568 • Views: …
More Releases from ABNewswire
Pioneering Vision: Anno Robot Defines Cognitive Retail's Future at CES 2026 with …
LAS VEGAS, NV - January 6, 2026 - As the International Consumer Electronics Show (CES) 2026 opens its doors in Las Vegas, the global technology community is abuzz with anticipation. Amidst a landscape of groundbreaking innovations, Anno Robot stands poised to fundamentally redefine the very fabric of retail. Recognized globally as a pioneer and a dominant force in AI robotics and smart retail solutions, Anno Robot is not merely showcasing…
Global Leader Anno Robot Unveils Smart Retail Future at CES 2026
LAS VEGAS, NV - January 6, 2026 - As the curtains rise on the International Consumer Electronics Show (CES) 2026, the global technology community turns its eyes to Las Vegas. Amidst the futuristic displays, one name resonates with unparalleled authority and vision: Anno Robot. Recognized globally as a pioneer and undisputed leader in AI robotics and smart retail solutions, Anno Robot is not merely exhibiting; it is orchestrating a profound…
The Best Electric Cars of 2025: Picks for the Top 10 Models of All Types of Elec …
The best electric cars [https://www.tianlisupplychain.com/automotive-new-cars-electric-vehicle/] to buy in 2025 A guide to the best electric cars in the UK Electric car buying tips and more
Welcome to our carefully curated list of the UK's best electric cars. This list is fully up-to-date as of 2025 and is continually tested as new electric vehicles enter the market. We present the most current zero-emission models available today. The CAR team highly recommends these…
What types of castings can be produced using green sand automatic foundry line?
Green sand automatic foundry lines [https://www.junengmachinery.com/products/] are ideal for mass production of small-to-medium-sized castings with relatively simple structures, primarily made of gray iron. While highly efficient and cost-effective, they have limitations in precision and complex geometries.
Suitable Casting Types:
Automotive Parts (Core Application):Engine blocks/heads (simpler designs), crankcases, flywheel housings, transmission cases, clutch housings, intake/exhaust manifolds.Brake drums, caliper housings, hubs, steering gear housings, differential cases, suspension arms.Pump housings, brackets (engine/mounting).Internal Combustion Engine &…
More Releases for ASE
Organic Package Substrates Market | AJINOMOTO, AMKOR, ASE Group, Daeduck
The global organic package substrates market report is a comprehensive report that provides a detailed analysis of the current status and future trends of the organic package substrates market worldwide. This report provides valuable information to industry stakeholders by offering an in-depth perspective on market dynamics, competitive landscape, growth opportunities, and key challenges faced by industry participants.
From the perspective of market dynamics, this report explores the factors driving the growth…
Multichip Package Market 2030 | IBM, SK Hynix Inc., ASE Group
Latest Published Report by Allied Market Research Titled,”Multichip Package Market By Type (Hybrid Circuit/Hybrid Integrated Circuit, Multichip Module, 3-D Packaging, and System in Package/System on Package), Packaging Technology (2D IC, 2.5D IC, and 3D IC), Package Type (Ball Grid Array, Surface Mount Package, Pin Grid Array, Flat Package, and Small Outline Package), Industry Vertical (Consumer Electronics, Aerospace & Defense, Automotive & Transport, Industrial, and Others): Global Opportunity Analysis and Industry…
Advanced IC Substrates Market 2021 Precise Outlook (CAGR 18%) - ASE Kaohsiung (A …
Global Advanced IC Substrates Market Size, Status and Forecast 2021-2025
The Advanced IC Substrates market report is the most important research for who looks for complete information on the Advanced IC Substrates market. The report covers all information on the global and regional markets including historic and future trends for market demand, size, trading, supply, competitors, and prices as well as global predominant vendor’s information. The forecast market information, SWOT analysis,…
Digisonics Receives ASE Certification for the ImageGuideEcho Registry
The American Society of Echocardiography (ASE) is pleased to announce that Digisonics has received Certification as a Software Reporting Vendor for the ImageGuideEchoTM Registry. Practitioners utilizing the Digisonics Cardiovascular Information System, DigiView, will be able to seamlessly transmit real-time data to the ImageGuideEcho Registry and thereby avoid manual data entry and workflow modification.
“Seamless data submission through Certified Software Reporting Vendors is critical to the success of the ImageGuideEcho Registry,” says…
Global Flip Chip Market 2018 - ASE Group, Amkor, Intel Corporation
Apex Market Research, recently published a detailed market research study focused on the "Flip Chip Market" across the global, regional and country level. The report provides 360° analysis of "Flip Chip Market" from view of manufacturers, regions, product types and end industries. The research report analyses and provides the historical data along with current performance of the global Flip Chip industry, and estimates the future trend of Flip Chip market…
Global Advanced Packaging Market - ASE, NFMCarsem, Amkor, SPIL, J-Devices
The report focuses on global major leading industry players with information such as company profiles, product picture and specifications, sales, market share and contact information. What’s more, the Advanced Packaging industry development trends and marketing channels are analyzed.
Global Advanced Packaging Market 2017, presents a professional and in-depth study on the current state of the Advanced Packaging market globally, providing basic overview of Advanced Packaging market including definitions, classifications, applications and…
