Sub-atmospheric Pressure CVD (SACVD) Equipment Market Share Driven by Advanced Dielectric Deposition and Process Integration | Valuates Reports

Sub-atmospheric Pressure CVD (SACVD) Equipment Market Size
The global market for Sub-atmospheric Pressure CVD (SACVD) Equipment was valued at US$ 91 million in the year 2024 and is projected to reach a revised size of US$ 157 million by 2031, growing at a CAGR of 7.5% during the forecast period.

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The Sub-atmospheric Pressure CVD (SACVD) Equipment market plays a vital role in semiconductor manufacturing by enabling high-quality dielectric film deposition under controlled pressure conditions. Market trends are driven by the growing complexity of integrated circuits, the need for superior gap-fill performance, and increasing emphasis on process stability and yield optimization. As device architectures continue to evolve, SACVD technology supports consistent film uniformity and reliability, directly influencing overall market size and sustained market growth.

Equipment designed for larger wafer formats holds the dominant market share, with solutions optimized for high-volume manufacturing gaining widespread adoption. Systems tailored for advanced wafer processing are expanding faster as fabs prioritize productivity, compatibility with modern process flows, and integration with other deposition and planarization steps. Other SACVD equipment variants maintain relevance in niche applications and legacy production lines, contributing to a diversified equipment landscape aligned with varying manufacturing requirements.

Among applications, the BPSG process represents a major market share due to its long-standing use in interlayer dielectric formation and reflow capabilities. SAF and SA TEOS processes are witnessing stronger market growth as manufacturers seek improved gap-fill performance, lower defectivity, and enhanced scalability for advanced device nodes. The coexistence of these applications reflects the adaptability of SACVD equipment across multiple dielectric deposition strategies.

Applied Materials leads the market share through its extensive deposition technology portfolio, strong process integration expertise, and deep relationships with leading semiconductor manufacturers. Piotech is expanding its footprint by offering competitive SACVD solutions tailored to regional manufacturing needs and advancing its process capabilities. Company strategies increasingly focus on equipment reliability, process optimization, and alignment with evolving fab requirements to strengthen competitive positioning.

North America holds a significant market share, supported by advanced semiconductor research, equipment innovation, and strong collaboration between technology providers and manufacturers. Asia-Pacific demonstrates the fastest market growth, driven by expanding fabrication capacity, strong investments in China, Japan, South Korea, and Taiwan, and increasing adoption of advanced process technologies. Europe and other regions contribute through specialized manufacturing and technology development. The market forecast remains positive as ongoing fab expansions, continuous process innovation, and rising demand for advanced dielectric deposition sustain long-term momentum for SACVD equipment.

by Type

• 8-inch SACVD Equipment
• 12-inch SACVD Equipment
• Others

by Application

• BPSG Process
• SAF Process
• SA TEOS Process

By Company

Applied Materials, Piotech, Inc.

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