CVD SiC Market Share Accelerates with Semiconductor Equipment Demand and Advanced Wafer Processing | Valuates Reports

CVD SiC Market Size
The global CVD SiC market is projected to grow from US$ 420.6 million in 2024 to US$ 620.7 million by 2030, at a Compound Annual Growth Rate (CAGR) of 6.7% during the forecast period.

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The CVD SiC Market is witnessing strong market growth driven by expanding semiconductor manufacturing, rising demand for power electronics, and increasing adoption of silicon carbide (SiC) materials in advanced wafer fabrication equipment. Chemical Vapor Deposition (CVD) Silicon Carbide offers superior thermal conductivity, plasma resistance, high purity, and chemical stability, making it essential in high-temperature and corrosive semiconductor processing environments. Growing investments in foundry capacity expansion and next-generation chip production are significantly increasing overall market size. Key market trends include higher purity grades, improved resistivity control, and precision machining technologies, supporting a positive market forecast and sustained long-term market growth.

By type, High Resistivity Grade holds a dominant market share due to its critical role in semiconductor processing components where electrical insulation and minimal contamination are required. Middle Resistivity Grade contributes significant market size in various wafer handling and plasma-facing components. Low Resistivity Grade is witnessing steady market growth, particularly in applications requiring enhanced conductivity and thermal performance. The diversification across resistivity grades supports balanced market growth aligned with evolving fabrication technologies.

In terms of application, Plasma Etch Components represent the largest market share, driven by increasing demand for high-durability materials capable of withstanding aggressive plasma environments. Rapid Thermal Process (RTP) Components account for substantial market size as chip manufacturers adopt advanced thermal processing techniques. Susceptors and dimwit Wafers demonstrate consistent market growth due to their importance in epitaxy and deposition processes. LED Wafer Carriers and Cover Plates are also contributing to expanding market size, particularly with the growth of compound semiconductor and optoelectronics production.

Leading companies shaping the competitive landscape include Tokai Carbon, Morgan Advanced Materials, Ferrotec, CoorsTek, AGC Inc., SKC Solmics, SGL Carbon, Toyo Tanso, and Mersen. These companies maintain substantial market share through advanced CVD processing technology, high-purity material development, precision machining capabilities, and close partnerships with semiconductor equipment manufacturers. Continuous R&D investment and production capacity expansion further strengthen their competitive positioning and support sustained market growth.

Regionally, Asia dominates overall market size, particularly Japan, South Korea, China, and Taiwan, supported by large-scale semiconductor fabrication capacity. North America, especially the United States, holds significant market share driven by domestic semiconductor equipment manufacturing and government-backed chip initiatives. Europe demonstrates steady market growth supported by advanced materials innovation in Germany and France. Southeast Asia and India are gradually increasing market size as semiconductor supply chains diversify. Latin America, the Middle East, and Africa show emerging market growth potential with expanding electronics and industrial investments.

Overall, the CVD SiC Market forecast remains highly positive, supported by accelerating semiconductor manufacturing, rising demand for advanced power devices, and the critical role of high-performance silicon carbide materials in next-generation chip production, reinforcing sustained global market growth.

By Company

Tokai Carbon
Morgan Advanced Materials
Ferrotec
CoorsTek
AGC
SKC Solmics
Sgl Carbon
Toyo Tanso
Mersen

By Type

Low Resistivity Grade
Middle Resistivity Grade
High Resistivity Grade

By Application

Rapid Thermal Process Components
Plasma Etch Components
Susceptors and Dimwit Wafer
LED Wafer Carriers and Cover Plates
Others

By Region

North America
Japan
South Korea
US & Canada
U.S.
Canada
China
Asia (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Latin America, Middle East & Africa
Brazil
Mexico
Turkey
Israel
GCC Countries

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This release was published on openPR.