Laser Anneal Machine for Power Semiconductor Market Set to Surge - Key Insights You Must Know

Laser Anneal Machine for Power Semiconductor Market Size

The global market for Laser Anneal Machine for Power Semiconductor was valued at US$ 450 million in the year 2024 and is projected to reach a revised size of US$ 843 million by 2031, growing at a CAGR of 9.7% during the forecast period.

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Semiconductor Laser Annealing Tool refers to a special equipment that uses high-energy laser beams to automatically anneal wafers. Its main function is to project a laser beam spot with a specific shape and uniform energy distribution onto a semiconductor wafer, which is carried and absorbed by a motion table for scanning , In order to complete the annealing process of the entire wafer. Laser Anneal Machine for Power Semiconductor is mainly used for the manufacture of power devices such as IGBT and SiC.

Since 2013, with the improvement of the overall prosperity of the global semiconductor industry, the scale of the semiconductor equipment market has shown a growth trend. Since foreign laser annealing equipment for power semiconductor companies started early and have long occupied a leading position in the industry with advantages in technology, capital and customers. The power semiconductor laser annealing equipment industry is a typical technology-intensive industry. The company needs to continue to invest a lot of manpower, financial and material resources to maintain the advancement of core technology and meet the needs of industrialization. In terms of technology, conventional laser annealing equipment generally uses a single beam to act on the wafer, and uses a motion platform to drive the wafer to scan back and forth relative to the laser beam, so that the laser beam can evenly irradiate the entire wafer, thereby completing the process. On the basis of conventional laser annealing technology, a variety of laser beams with different absorption characteristics are used for superposition annealing, which has many advantages in technology. It can not only more effectively control the annealing temperature field to achieve the purpose of greatly improving the impurity activation efficiency, but also the superposition of multiple beams can reduce the thermal budget of each beam, which is more conducive to the equipment to form a high-yield output.

The main downstream customers of power semiconductor laser annealing equipment are major semiconductor manufacturers. The industry has a high degree of capacity concentration, which means that customer concentration is too high. Once the cooperation breaks down, especially for leading manufacturers, it will have a great impact on the industry.

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The main laser annealing equipment for power semiconductor manufacturers in the global market include Mitsui Group (JSW), Sumitomo Heavy Industries, SCREEN Semiconductor Solutions and Hitachi. The top three companies in the world account for more than 50% of the market. The overall market concentration is high, and most of the high-end market is monopolized by foreign companies. It is expected that industry competition will become more intense in the next few years, especially in the Chinese market.

By Type
• IGBT Backside Annealing
• SiC Back Annealing

By Application
• 200mm Wafer
• 300mm Wafer
• 150mm Wafer

Key Companies
Mitsui Group(JSW), Sumitomo Heavy Industries, Shanghai Micro Electronics Equipment, SCREEN Semiconductor Solutions, Hitachi, YAC BEAM, EO Technics, Beijing U-PRECISION Tech, Chengdu Laipu Technology, ETA Semitech, Hans DSI

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This release was published on openPR.