Rotary Unions for CMP Equipment Market Share Driven by Advancements in Semiconductor Manufacturing and High-Precision Fluid Transfer | Valuates Reports

Rotary Unions for CMP Equipment Market
The global market for Rotary Unions for CMP Equipment was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.

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The Rotary Unions for CMP Equipment Market is gaining strong traction as semiconductor manufacturers increase their focus on precision control, contamination reduction, and high-efficiency wafer polishing processes. Rising investment in advanced semiconductor fabrication, coupled with the push for higher wafer output and improved surface uniformity, is shaping market size and market growth. Market trends reflect a shift toward durable, maintenance-optimized rotary unions designed to withstand demanding chemical mechanical planarization environments.

In the type segment, multi-passage rotary unions hold a substantial market share due to their ability to support simultaneous transfer of multiple media, including slurry, air, vacuum, and cooling fluids, within CMP tools. Their multifunctional capabilities make them essential for modern multi-zone polishing systems and complex semiconductor workflows. The single-passage rotary unions segment is also expanding as a reliable option for simpler CMP equipment configurations, contributing to broader adoption across varied end-use scenarios.

By application, the wafer foundry segment leads the market share, driven by high-volume chip production and continuous scaling of advanced process nodes. Foundries increasingly rely on precision rotary unions to support stable polishing performance and reduce downtime in CMP lines. IDM enterprises are experiencing fast market growth as they enhance in-house manufacturing capabilities and integrate high-reliability rotary unions into their production ecosystems. The others segment retains relevance across specialized semiconductor polishing applications and supporting equipment.

The competitive landscape features established players such as Deublin, Eagle Industry, DSTI (Dynamic Sealing Technologies, Inc.), Moog GAT, and Rotary Systems, all of which maintain strong market share through engineering expertise and robust product portfolios. Additional innovators like Sealink, Kadant, RIX Corporation, Rotoflux, and Shenzhen Moflon Technology are strengthening market growth with advancements in sealing technologies, corrosion-resistant materials, and higher-precision rotary interface designs. Their strategic focus on performance reliability, extended service life, and customized semiconductor-grade solutions positions them competitively in the global market.

Regionally, North America, Europe, China, and Japan dominate production due to their strong semiconductor manufacturing bases and investment in CMP tool innovation. Consumption is heavily concentrated in North America, Europe, and Asia-Pacific, supported by expanding wafer fabrication capacity and increasing adoption of advanced CMP equipment. Growth in Southeast Asia and Latin America reflects emerging semiconductor activity and supportive industrial policies. The market forecast indicates sustained expansion as semiconductor producers prioritize process precision, capacity scaling, and integration of high-performance rotary unions to meet evolving technology demands.

by Type

• Multi Passage Rotary Unions
• Single Passage Rotary Unions

by Application

• Wafer Foundry
• IDM Enterprises
• Others

By Company

Deublin, Eagle Industry, DSTI (Dynamic Sealing Technologies, Inc), Moog GAT, Rotary Systems, Sealink, Kadant, RIX Corporation, Rotoflux, Shenzhen Moflon Technology

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