CMP Materials for Semiconductor Market Share Driven by CMP Slurry and Widespread Adoption in 300mm Wafer Processing | Valuates Reports

CMP Materials for Semiconductor Market Size
The global market for CMP Materials for Semiconductor was valued at US$ 3701 million in the year 2024 and is projected to reach a revised size of US$ 5657 million by 2031, growing at a CAGR of 6.3% during the forecast period.

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The CMP (Chemical Mechanical Planarization) Materials for Semiconductor market is witnessing consistent growth as global chip manufacturers pursue higher precision and yield in wafer fabrication. CMP materials play a vital role in planarizing semiconductor layers during the production of advanced logic and memory chips, contributing to the overall market size and influencing key market trends focused on sub-nanometer flatness, defect control, and process integration in advanced nodes.

By type, CMP slurry holds the largest market share, serving as the core consumable in the planarization process. These slurries, composed of abrasives and chemicals, are critical in removing excess material while maintaining strict control over surface topography. CMP pads also represent a significant segment, offering optimized surface textures and material resilience to support consistent planarization results. CMP pad conditioners ensure pad longevity and performance by maintaining surface roughness, while POU slurry filters help eliminate contaminants, supporting defect-free polishing. CMP PVA brushes are used in post-CMP cleaning steps, and CMP retaining rings ensure wafer alignment and pressure distribution-each contributing uniquely to process quality and wafer throughput.

In terms of application, 300mm wafers dominate the market share, as they are the industry standard for advanced semiconductor manufacturing, particularly in producing high-performance logic, DRAM, and NAND chips. The shift to 300mm wafers allows for greater yield per wafer and cost efficiency, driving continuous investment in high-performance CMP materials. The 200mm wafer segment maintains relevance for legacy nodes and specialty semiconductors used in analog, power, and automotive devices. The "Others" category includes smaller wafer sizes and specialized applications in R&D or pilot production environments.

Looking ahead, the market forecast points to sustained growth, driven by increasing complexity in chip architectures, expansion of 3D NAND and FinFET processes, and the global ramp-up of advanced foundries. The CMP Materials for Semiconductor market is well-positioned for long-term expansion, with CMP slurry and 300mm wafer applications continuing to anchor the industry's progression toward smaller nodes and higher-density chip designs.

Segment by Type

• CMP Slurry
• CMP Pads
• CMP Pad Conditioners
• CMP POU Slurry Filters
• CMP PVA Brushes
• CMP Retaining Rings

Segment by Application

• 300 Wafers
• 200 Wafers
• Others

By Company
Fujifilm, Resonac, Fujimi Incorporated, DuPont, Merck KGaA (Versum Materials), AGC, KC Tech, JSR Corporation, Anjimirco Shanghai, Soulbrain, Saint-Gobain, Ace Nanochem, Dongjin Semichem, Vibrantz (Ferro), WEC Group, SKC (SK Enpulse), Shanghai Xinanna Electronic Technology, Hubei Dinglong, Beijing Hangtian Saide, Fujibo Group, 3M, FNS TECH, IVT Technologies Co, Ltd., TWI Incorporated, KPX Chemical, Engis Corporation, TOPPAN INFOMEDIA, Samsung SDI, Pall, Cobetter, Kinik Company, Saesol Diamond, EHWA DIAMOND, Nippon Steel & Sumikin Materials, Shinhan Diamond, BEST Engineered Surface Technologies, Willbe S&T, CALITECH, Cnus Co., Ltd., UIS Technologies, Euroshore, PTC, Inc., AKT Components Sdn Bhd, Ensinger, CHUANYAN, Zhuhai Cornerstone Technologies, Konfoong Materials International, Tianjin Helen, Shenzhen Angshite Technology, Advanced Nano Products Co.,Ltd, Zhejiang Bolai Narun Electronic Materials, Xiamen Chia Ping Diamond Industrial

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