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Power GaN Substrate Wafer Market Share Driven by Wide Adoption of High-Efficiency Power Electronics | Valuates Reports

11-19-2025 09:13 AM CET | Advertising, Media Consulting, Marketing Research

Press release from: Valuates Reports

Power GaN Substrate Wafer Market Size
The global market for Power GaN Substrate Wafer was valued at US$ 117 million in the year 2024 and is projected to reach a revised size of US$ 646 million by 2031, growing at a CAGR of 28.1% during the forecast period.

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The Power GaN Substrate Wafer Market is expanding as industries transition toward high-efficiency, high-frequency semiconductor devices that offer improved power density and reduced energy loss. Market trends show strong growth in electric mobility, fast charging, 5G infrastructure, renewable energy systems, industrial power supplies, and next-generation power modules, contributing to continuous market expansion. The increasing commercialization of GaN-on-silicon technology is improving market size by enabling cost-efficient manufacturing while achieving superior output performance in compact device architectures.

In terms of type, 6-inch GaN-on-Si wafers currently represent the largest market share, supported by mature manufacturing processes, strong adoption in consumer and industrial applications, and broad availability from leading suppliers. The 8-inch GaN-on-Si wafer segment is growing rapidly as companies scale to meet rising demand for higher-volume production and integration into advanced device platforms. Development efforts around 12-inch wafers and other emerging formats are strengthening the technology roadmap, allowing manufacturers to improve economies of scale and expand market reach across diverse fabrication environments.

By application, consumer electronics remains the dominant segment, powered by increasing adoption of GaN-based fast chargers, power adapters, and compact power conversion systems. Industrial and telecom & datacom applications represent major growth engines as GaN becomes widely used in base stations, power servers, data infrastructure, and high-efficiency industrial machinery. Automotive electronics is experiencing significant expansion as electric vehicles adopt GaN for on-board chargers, traction systems, power modules, and charging infrastructure. Defense, aerospace, renewable energy systems, and other applications contribute further to market growth, driven by operational efficiency, thermal performance advantages, and compact system design benefits.

Leading companies including Soitec (EpiGaN), Transphorm, Sumitomo Electric Device Innovations, NTT Advanced Technology, and DOWA Electronics Materials hold a substantial share of the market through strong material engineering capabilities, long-term partnerships with semiconductor manufacturers, and continuous investment in GaN epitaxy and wafer technology. Companies such as Enkris Semiconductor, Innoscience, China Resources Microelectronics, Sanan Optoelectronics, Episil-Precision, and Epistar are accelerating market growth through high-volume production, strategic capacity expansion, and technology development across global supply chains. Collaborations within device manufacturing, substrate production, and epitaxial process optimization continue to reinforce market competitiveness and product availability.

Regionally, Asia-Pacific leads the market share, driven by strong semiconductor manufacturing capacity in China, Japan, South Korea, and Taiwan, along with large-scale development of consumer electronics, automotive power systems, and telecom infrastructure. North America demonstrates strong adoption across datacom, aerospace, industrial electrification, and high-performance computing sectors. Europe continues to advance GaN development through major research initiatives, energy regulations, power device integration, and automotive electronics demand. With manufacturing scale-up, technology innovation, and sustained demand across multiple verticals, the market forecast indicates strong ongoing market growth, supported by electrification trends, efficiency mandates, and increasing global deployment of GaN-based power solutions.

by Type

• 6 inch GaN-on-Si Wafer
• 8 inch GaN-on-Si Wafer
• 12 inch GaN-on-Si Wafer
• Others

by Application

• Consumer Electronics
• Industrial
• Telecom & Datacom
• Automotive Electronics
• Defense & Aerospace
• Renewable & Energy Storage
• Others

By Company

IQE, Soitec (EpiGaN), Transphorm Inc., Sumitomo Electric Device Innovations (SEDI) (SCIOCS), NTT Advanced Technology (NTT-AT), DOWA Electronics Materials, BTOZ, Episil-Precision Inc, Epistar Corp., Enkris Semiconductor Inc, Innoscience, China Resources Microelectronics Limited, CorEnergy, Suzhou Nanowin Science and Technology, Qingdao Cohenius Microelectronics, Shaanxi Yuteng Electronic Technology, Sanan Optoelectronics, IVWorks

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https://reports.valuates.com/market-reports/QYRE-Auto-12F17059/global-power-gan-substrate-wafer

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