Semiconductor Pellicle Market Size, Trends & Forecasts | Valuates Reports

Semiconductor Pellicle Market Size

The global market for Semiconductor Pellicle was valued at US$ 430 million in the year 2024 and is projected to reach a revised size of US$ 640 million by 2031, growing at a CAGR of 6.0% during the forecast period.

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The 2025 U.S. tariff policies introduce profound uncertainty into the global economic landscape. This report critically examines the implications of recent tariff adjustments and international strategic countermeasures on Semiconductor Pellicle competitive dynamics, regional economic interdependencies, and supply chain reconfigurations.

The pellicle acts as part of the reticle and acts as a cover to prevent defects by preventing foreign matter from entering the mask engraved with the circuit, thereby protecting the reticle on the wafer from contamination during the photolithography process.

The process of preparing this Pellicle is also full of scientific and technological content. Usually, precise vacuum coating technology such as physical vapor deposition (PVD) or chemical vapor deposition (CVD) is used to form a uniform and dense film on the surface of the mask. This process requires precise control of parameters such as temperature, pressure and gas flow to ensure the quality and performance of the film.

Global key Photomask Pellicle players cover Mitsui Chemicals, Shin-Etsu, FINE SEMITECH, Micro Lithography, Inc., S&S Tech and INKO, etc. In terms of revenue, the global 3 largest companies occupied for a share nearly 80% in 2024.

In semiconductor manufacturing, the role of this Pellicle is far more than simple physical protection. It can also effectively reduce the diffraction effect in the lithography process and improve the imaging quality. Especially in extreme ultraviolet lithography (EUVL) technology, due to the extremely short wavelength of the light source (about 13.5nm), the traditional penetrating mask can no longer be used. At this time, the reflective mask and its Pellicle have become the key technology.

It is worth noting that with the continuous advancement of chip manufacturing technology, the requirements for the mask Pellicle are getting higher and higher. For example, in advanced processes of 7nm and below, the size of the pattern on the mask may be only tens of nanometers, which puts extremely stringent requirements on the uniformity and defect control of the Pellicle.

By Type
• ArF Pellicle
• KrF Pellicle
• EUV Pellicle

By Application
• IC Bumping
• IC Foundry
• IC Substrate
• MEMS
• LED Package

Key Companies
MITSUI Chemical, FINE SEMITECH, Shin-Etsu, Micro Lithography, Inc., S&S Tech, INKO, NEPCO, Canatu

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This release was published on openPR.