EUV Lithography Pellicle Market Size, Trends & Forecasts | Valuates Reports

EUV Lithography Pellicle Market Size

The global market for EUV Lithography Pellicle was valued at US$ 78.8 million in the year 2024 and is projected to reach a revised size of US$ 171 million by 2031, growing at a CAGR of 8.6% during the forecast period.

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In a typical semiconductor process, a thin protective film is usually placed on the surface of the photomask to protect it from contaminants. This thin film, called a pellicle, prevents undesirable conditions or defects in the wafer circuit pattern, thereby protecting the IC chip from potential damage. In addition, the mask protective film is also a consumable that needs to be replaced regularly, and because the light source wavelength of EUV lithography equipment is shorter, the protective film needs to be thinner to increase light transmittance.

Initially, the pellicle was a single-layer structure with a core layer made of polysilicon. Since 2021, EUV pellicle have adopted composite materials. Its key components now consist of alternating molybdenum disilicide (MoSi2) and silicon (Si) layers to form a multi-layer structure. EUV transmittance (EUVT) is a key performance indicator of EUV pellicle. The transition from a single-layer structure to a multi-layer structure has increased EUVT from about 82% to about 90%. The next generation of film technology will go beyond structural changes (from single-layer to multi-layer) and introduce material advances, leading to the emergence of CNT pellicle.

Driven by advances in artificial intelligence (AI) and computing technology, the semiconductor industry's demand for advanced chips continues to grow, with the fastest growth in chips below 7nm manufactured using EUV technology. In advanced processes of 7nm and below, the pattern size on the mask may be only tens of nanometers, which places extremely strict requirements on the uniformity and defect control of the Pellicle. The next generation of high-power EUV lithography machines operates at more than 500W, and EUV films are needed to protect the photomask from particle contamination during chip production.

In recent years, the phenomenon of chipmakers adopting extreme ultraviolet (EUV) processes in their advanced chip manufacturing is rapidly increasing. To meet this growing demand, many companies are developing protective films for EUV processes.

ASML launched its first EUV pellicle in 2019 and licensed the technology to Mitsui Chemicals, which began mass sales in 2021. Since then, ASML has made improvements to its pellicle. It is reported that Mitsui Chemicals' next-generation CNT pellicle production facility will be completed by the end of 2025.

In 2021, South Korean company S&S Tech developed a pellicle with a transmittance of more than 90%. FST's EUV pellicle is still in the development stage.

Canatu has been working with Imec since 2015 to develop CNT pellicle to meet performance targets such as life and transmittance, thermal durability, permeability and strength.

By Type
• Transmittance: >90%
• Transmittance: ≤ 90%

By Application
• Integrated Device Manufacturer (IDM)
• Foundry

Key Companies
Mitsui, S&S Tech, Canatu, TSMC

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This release was published on openPR.