Semiconductor CMP Polishing Pad Latest Market Report 2025

On Nov 5, Global Info Research released "Global Semiconductor CMP Polishing Pad Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031". This report includes an overview of the development of the Semiconductor CMP Polishing Pad industry chain, the market status of Semiconductor CMP Polishing Pad Market, and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Semiconductor CMP Polishing Pad.

According to our (Global Info Research) latest study, the global Semiconductor CMP Polishing Pad market size was valued at US$ 1089 million in 2024 and is forecast to a readjusted size of USD 1737 million by 2031 with a CAGR of 7.0% during review period.
Chemical Mechanical Polishing (CMP), a key technology in the integrated circuit manufacturing process, uses both chemical erosion and mechanical force to planarize single-crystal silicon wafers and metal interconnect layers during processing. The semiconductor CMP polishing pad, also known as the chemical mechanical polishing pad, is a critical core material used in the chemical mechanical polishing process. It primarily serves to store the polishing slurry and distribute it evenly across the entire working area of the wafer, ensuring uniform polishing, removing residues generated during the polishing process, transmitting the mechanical energy required for material removal, and maintaining the necessary mechanical and chemical environment throughout the polishing process.
In the CMP process, the selection and use of the polishing pad are crucial for ensuring product quality and improving production efficiency. The appropriate polishing pad must be chosen based on various factors such as the type of silicon wafer material, the size and shape of the abrasive particles, the composition and application method of the polishing slurry, and other parameters. Strict control over these parameters during the polishing process is essential to achieve optimal polishing results.
The CMP polishing pad is an indispensable material in semiconductor manufacturing, and its performance directly affects the quality of the wafer surface. By selecting the appropriate polishing pad and strictly controlling the parameters during the polishing process, high-quality wafer surfaces can be ensured.
Currently, considering cost factors and the impact of silicon wafer size on the performance and efficiency of integrated circuits, the trend towards larger wafer sizes has become an inevitable and mainstream direction. Especially for 8-inch and 12-inch products, there is a possibility of moving towards 18-inch wafers in the future. However, as the size increases, so does the difficulty in producing corresponding CMP pads. As the trend towards larger downstream sizes becomes inevitable, to capture the market, it will be necessary to develop large-sized polishing pads; otherwise, one risks being phased out by the market. With the increasing expectations for superior performance of integrated circuits, the polishing performance of CMP pads must also improve. Therefore, more stringent requirements will be placed on their performance in the future.
From a consumer perspective, South Korea is currently the largest global consumer market, accounting for 23.52% of market revenue share in 2023, followed by mainland China and Taiwan, with shares of 21.71% and 19.02%, respectively. It is projected that China will experience the fastest growth over the next few years, with a CAGR of 9.30% from 2024 to 2030. In the coming years, China may reduce its import volume and rely more on domestic suppliers, although these companies may find it difficult to export. Given that the major consumption regions already have leading global enterprises, Europe might be the first region where Chinese companies can break through. Therefore, in the next few years, domestic Chinese enterprises' products will primarily focus on the domestic market. Additionally, due to current trade frictions and international political factors, this period could be the best opportunity for domestic CMP polishing pad manufacturers to capture the market, with national policy support expected to increase significantly in the coming years. Thus, the next few years present a significant localization opportunity for Chinese enterprises. We predict that Hubei Dinglong Holding Co., Ltd. might proactively lower product prices to aggressively capture market share.
In terms of producers, globally, key vendors of CMP polishing pads include DuPont, Entegris, Hubei Dinglong, Fujibo, and IVT Technologies, among others. In 2023, the top-tier vendors, mainly DuPont and Entegris, accounted for 76% of the market's revenue share; second-tier vendors, including Hubei Dinglong, Fujibo, and others, collectively held 15.84% of the revenue share. The CMP (Chemical Mechanical Polishing) polishing pad industry is currently in a stage of continuous growth, primarily driven by the demand for higher performance and smaller node sizes in semiconductor manufacturing. CMP polishing pads play a critical role in ensuring the precise flatness of the semiconductor wafer surface, especially in advanced node technologies (such as 7nm and 5nm processes), which require even stricter polishing standards. As a foundational, pioneering, and strategic pillar industry crucial to the national economy and social development, the semiconductor industry receives strong support from national and local policies. Among these, the substantial need for localization of core process materials in the semiconductor industry has become a widely recognized consensus, presenting a favorable situation of rapid growth. The dependence on imported semiconductor materials in China is quite high, making the demand for import substitution urgent. Under the combined influence of market demand, technological advancements, and policy incentives, domestic semiconductor material enterprises are showing an accelerated growth trend, with vast potential for development.
Currently, none of the several marketized companies in China have obtained foreign certifications, thus they do not export. Since the main downstream enterprises are concentrated in Japan, Taiwan, South Korea, and Europe and America, and given that, apart from Europe and South Korea, the other regions have significant market positions for their local CMP polishing pad enterprises, domestic Chinese enterprises' products will primarily target the domestic market in the next few years.
This report is a detailed and comprehensive analysis for global Semiconductor CMP Polishing Pad market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

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Market segment by Type: Polymer CMP Pad、 Non-woven CMP Pad、 Composite CMP Pad
Market segment by Application: 300 mm Wafer、 200 mm Wafer、 Others
Major players covered: DuPont、 Entegris、 Hubei Dinglong、 Fujibo、 IVT Technologies、 SK enpulse、 KPX Chemical、 TWI Incorporated、 3M、 FNS TECH
Market segment by region, regional analysis covers: North America (United States, Canada and Mexico), Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe), Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia),South America (Brazil, Argentina, Colombia, and Rest of South America),Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa).

The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Semiconductor CMP Polishing Pad product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Semiconductor CMP Polishing Pad, with price, sales, revenue and global market share of Semiconductor CMP Polishing Pad from 2020 to 2025.
Chapter 3, the Semiconductor CMP Polishing Pad competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Semiconductor CMP Polishing Pad breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2020 to 2024.and Semiconductor CMP Polishing Pad market forecast, by regions, type and application, with sales and revenue, from 2025 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Semiconductor CMP Polishing Pad.
Chapter 14 and 15, to describe Semiconductor CMP Polishing Pad sales channel, distributors, customers, research findings and conclusion.

Data Sources:
Via authorized organizations:customs statistics, industrial associations, relevant international societies, and academic publications etc.
Via trusted Internet sources.Such as industry news, publications on this industry, annual reports of public companies, Bloomberg Business, Wind Info, Hoovers, Factiva (Dow Jones & Company), Trading Economics, News Network, Statista, Federal Reserve Economic Data, BIS Statistics, ICIS, Companies House Documentsm, investor presentations, SEC filings of companies, etc.
Via interviews. Our interviewees includes manufacturers, related companies, industry experts, distributors, business (sales) staff, directors, CEO, marketing executives, executives from related industries/organizations, customers and raw material suppliers to obtain the latest information on the primary market;
Via data exchange. We have been consulting in this industry for 16 years and have collaborations with the players in this field. Thus, we get access to (part of) their unpublished data, by exchanging with them the data we have.

From our partners.We have information agencies as partners and they are located worldwide, thus we get (or purchase) the latest data from them.
Via our long-term tracking and gathering of data from this industry.We have a database that contains history data regarding the market.

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