Positive Photoresist for Integrated Circuit Market Share Driven by Advanced Lithography and Semiconductor Innovation | Valuates Reports

Positive Photoresist for Integrated Circuit Market Size

The global market for Positive Photoresist for Integrated Circuit was valued at US$ 1671 million in the year 2024 and is projected to reach a revised size of US$ 2433 million by 2031, growing at a CAGR of 5.6% during the forecast period.

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The Positive Photoresist for Integrated Circuit market is witnessing accelerating market growth fueled by the global expansion of semiconductor fabrication and the transition toward advanced lithography technologies. Positive photoresists, which become soluble upon light exposure, are crucial in defining fine circuit patterns during chip manufacturing. The rising demand for high-resolution imaging, pattern accuracy, and process stability is expanding the overall market size. Key market trends include the integration of next-generation photoresists into Extreme Ultraviolet (EUV) and Deep Ultraviolet (DUV) lithography systems, the miniaturization of transistors, and the continuous evolution of resist chemistry to support sub-5 nm process nodes.

By type, the Deep Ultraviolet (DUV) photoresist segment currently holds the largest market share, driven by its extensive use in advanced lithography processes across high-volume semiconductor production. The Ultraviolet (UV) photoresist segment remains vital for mature technology nodes and specialty electronics manufacturing, while the Extreme Ultraviolet (EUV) photoresist segment is experiencing the fastest market growth, supported by ongoing adoption in leading-edge chip fabrication. The Electron Beam photoresist segment caters to niche, high-precision applications such as mask writing and prototype development, reinforcing the technology's diverse applicability across semiconductor processes.

In terms of application, chip production dominates the market, reflecting the growing need for ultra-fine pattern transfer and process reliability in logic and memory device manufacturing. Positive photoresists are integral to achieving high yield, low defectivity, and dimensional control in wafer production. The advanced packaging segment is emerging rapidly, driven by innovations in heterogeneous integration and 3D chip stacking. As semiconductor packaging evolves beyond traditional boundaries, photoresists are increasingly used in redistribution layers, wafer-level packaging, and through-silicon via (TSV) formation, contributing to overall market growth and process innovation.

Among leading companies, Merck KGaA, Tokyo Ohka Kogyo (TOK), JSR Corporation, Shin-Etsu Chemical, and Fujifilm command significant market share through strong product portfolios and long-term partnerships with global semiconductor manufacturers. DuPont, Sumitomo Chemical, and Chimei continue to enhance their competitive positions through R&D in high-purity materials and EUV-compatible formulations. Emerging players such as Rongda Photosensitive Technology, Red Avenue New Materials, Aisen Semiconductor Material, and Niopik are expanding regional capabilities and material innovation pipelines, driving market trends through cost efficiency and localized production strategies.

Regionally, the Asia-Pacific (APAC) region dominates the Positive Photoresist for Integrated Circuit market, supported by the robust semiconductor manufacturing ecosystem in Japan, South Korea, Taiwan, and China. Strong government support for semiconductor self-sufficiency and continuous investments in lithography infrastructure are further fueling regional leadership. North America and Europe remain key contributors, driven by advanced material research, collaborations with major fabs, and strategic efforts to strengthen supply chain resilience. The market forecast indicates sustained expansion as chipmakers adopt high-performance photoresists optimized for EUV and advanced DUV processes, positioning the industry for continued innovation and high-precision semiconductor fabrication.

By Type
• Ultraviolet Photoresist
• Deep Ultraviolet Photoresist
• Extreme Ultraviolet Photoresist
• Electron Beam Photoresist

By Application
• Chip Production
• Advanced Packaging

Key Companies
Merck KGaA, Tokyo Ohka Kogyo, JSR Corporation, Shin-Etsu Chemical, Fujifilm, Niopik, DuPont, Chimei, Sumitomo Chemical, Rongda Photosensitive Technology, Red Avenue New Materials, Aisen Semiconductor Material

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This release was published on openPR.