Underfills for Semiconductor Market Size, Revenue Share, Insights & Future Outlook

Underfills for Semiconductor Market Size

The global market for Underfills for Semiconductor was valued at US$ 276 million in the year 2024 and is projected to reach a revised size of US$ 460 million by 2031, growing at a CAGR of 7.1% during the forecast period.

The 2025 U.S. tariff policies introduce profound uncertainty into the global economic landscape. This report critically examines the implications of recent tariff adjustments and international strategic countermeasures on Underfills for Semiconductor competitive dynamics, regional economic interdependencies, and supply chain reconfigurations.

Download Free Sample: https://reports.valuates.com/request/sample/QYRE-Auto-29D9833/Global_Underfills_for_Semiconductor_Market_Research_Report_2022?utm_source=Openpr&utm_medium=Referral

Underfills for Semiconductor is a key packaging material for connecting chips to substrates. Its core functions include: filling the gap between the chip and the substrate through capillary action to disperse surface stress, effectively alleviating the internal stress caused by the difference in thermal expansion coefficients between the chip, solder and substrate; at the same time, forming a physical protective layer to enhance the impact resistance of the solder balls, significantly improving the reliability of the chip under drop shock and thermal cycling conditions.

From the perspective of application scenarios, underfill can be divided into two categories: board-level packaging applications (PCB) and wafer/panel-level packaging applications. Among them, BGA Underfill is the leading field in the field of board-level packaging, which is mainly used to achieve the gap filling of the solder ball array between the packaging substrate and the PCB circuit board, and its process accuracy is required to reach the millimeter level; while the chip-level packaging field corresponds to the flip-chip underfill (Flip-Chip Underfill), which is specially used for the precision filling of the micro-bump array between the chip and the packaging substrate, and the process window requires micron-level accuracy.

In the Underfill market, the leading companies are mainly from Japan and Europe, such as NAMICS, Henkel, RESONAC, Nagase ChemteX Corporation, Shin-Etsu Chemical, Zymet, MacDermid Alpha, etc. There are certain differences in the applications faced by different companies. In the semiconductor (chip-level packaging) market, the mainstream company is Japan's NAMICS, and the Chinese local company is Darbond Technology. In the PCB field, the core company is Henkel.

By Type
• PLP Underfill
• WLP Underfill

By Application
• Consumer Electronics
• Automotive
• Telecom & Infrastructure
• Medical
• Industrial
• Aerospace & Defense

Key Companies
NAMICS, Henkel, RESONAC, Nagase ChemteX Corporation, Shin-Etsu Chemical, Panasonic, MacDermid Alpha, Sunstar, Fuji Chemical, Zymet, Shenzhen Dover, Threebond, AIM Solder, Darbond, Master Bond, Jiangsu HHCK Advanced Materials Co.,Ltd, Parker Hannifin, Asec Co., Ltd., Panacol-Elosol, United Adhesives, Henan Siny Optic-com Co., Ltd, Dongguan Hanstars, GTA Material, H.B.Fuller

View Full Report: https://reports.valuates.com/market-reports/QYRE-Auto-29D9833/global-underfills-for-semiconductor?utm_source=Openpr&utm_medium=Referral

Please reach us at sales@valuates.com

Address:
Valuates,
4th Floor,
Balaraj's Arcade,
Whitefield Main road,
Bangalore 560066

Valuates offers an extensive collection of market research reports that helps companies to take intelligent strategical decisions based on current and forecasted Market trends.

This release was published on openPR.