Press release
Multi-core Fiber Fan-In and Fan-Out Device Market Revenue Share, Insights & Future Outlook
Multi-core Fiber Fan-In and Fan-Out Device Market SizeThe global market for Multi-core Fiber Fan-In and Fan-Out Device was valued at US$ 277 million in the year 2024 and is projected to reach a revised size of US$ 462 million by 2031, growing at a CAGR of 7.7% during the forecast period.
The major global manufacturers of Multi-core Fiber Fan-In and Fan-Out Device include Sumitomo Electric, Corning, L-com, SENKO Advanced Components, YOFC, Accelink Technologies, Beijing Luyuan, Shanghai Optoweave Technology, HYC, Shanghai Zhixian Micro Optoelectronics, etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.
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By Type
• Jumper Type: FC/PC
• Jumper Type: FC/APC
• Jumper Type: Bare Fiber
By Application
• Data Center
• Fibre Channel
Key Companies
Sumitomo Electric, Corning, L-com, SENKO Advanced Components, YOFC, Accelink Technologies, Beijing Luyuan, Shanghai Optoweave Technology, HYC, Shanghai Zhixian Micro Optoelectronics, Hirundo Optics
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