United States High Bandwidth Memory (HBM) Market Surges with AI, Data Centers, and 5G Driving Next-Gen Performance 2025 | Top key players - Micron Technology, SK Hynix, Samsung Electronics.

Market Size and Growth:

The Global High Bandwidth Memory (HBM) Market size reached US$ 2.90 billion in 2024 and is expected to reach US$ 15.67 billion by 2032, growing with a CAGR of 23.63% during the forecast period 2025-2032.

The High Bandwidth Memory (HBM) Market report by DataM Intelligence provides insights into the latest trends and developments in the market. This report identifies the key growth opportunities in the market and provides recommendations for market participants to capitalize on these opportunities. Overall, the High Bandwidth Memory (HBM) market report is an essential resource for market participants who are looking to gain a comprehensive understanding of the market and identify opportunities for growth.

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The High Bandwidth Memory (HBM) Market refers to the global industry focused on advanced memory technology that delivers high data transfer rates, low power consumption, and compact form factors. HBM is widely used in applications such as artificial intelligence, high-performance computing, graphics processing, and data centers, driving innovation and efficiency in next-generation computing systems.

Recent Key Developments of United States (U.S):

Micron's U.S. Investment: On June 12, 2025, Micron announced a $200 billion commitment to U.S. memory infrastructure, with a significant portion allocated for HBM manufacturing and R&D in Idaho, Virginia, and a new facility in New York.

Micron's HBM Sales Surge: In June 2025, Micron reported a nearly 50% increase in HBM chip sales quarter-over-quarter, driven by soaring demand from AI data centers, particularly from companies like NVIDIA and AMD.

Micron's HBM3E Production: By June 2025, Micron had ramped up its volume shipments of 12-high HBM3E and began sampling its HBM4 products for platforms expected in 2026.

HBM4 Standard Adoption: The JEDEC Solid State Technology Association officially announced the HBM4 standard in April 2025. This new standard offers higher data rates and capacity.

U.S. Export Controls: In April 2025, the U.S. imposed new tariffs and export controls on advanced computing chips and AI model weights, impacting the global semiconductor supply chain, including HBM.

Key Players:

Micron Technology, Inc.
Advanced Micro Devices, Inc.
Broadcom
Cadence Design Systems, Inc.
Marvell
HUAWEI TECHNOLOGIES
Infineon Technologies AG
SK HYNIX INC.
RM Holdings PLC ADR
Intel Corporation.

This Report Covers:

✔ Go-to-market Strategy.

✔ Neutral perspective on the market performance.

✔Development trends, competitive landscape analysis, supply side analysis, demand side analysis, year-on-year growth, competitive benchmarking, vendor identification, and other significant analysis, as well as development status.

✔Customized regional/country reports as per request and country level analysis.

✔ Potential & niche segments and regions exhibiting promising growth covered.

✔ Analysis of Market Size (historical and forecast), Total Addressable Market (TAM), Serviceable Available Market (SAM), Serviceable Obtainable Market (SOM), Market Growth, Technological Trends, Market Share, Market Dynamics, Competitive Landscape and Major Players (Innovators, Start-ups, Laggard, and Pioneer).

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Market Segmentation:

By Type: HBM, HBM2, HBM2E, HBM3E.

By Memory Capacity: Up to 4GB, 4GB to 8GB, 8GB to 16GB, Above 16GB.

By Application: Graphics Processing Units (GPUs), Central Processing Units (CPUs), Field Programmable Gate Arrays (FPGAs), Application-Specific Integrated Circuits (ASICs), Networking and Data Centers, Others.

By End-Users: IT & Telecommunication, Consumer Electronics, Automotive, Healthcare, Defense & Aerospace, Others.

Regional Analysis:

⇥ North America (U.S., Canada, Mexico)

⇥ Europe (U.K., Italy, Germany, Russia, France, Spain, The Netherlands and Rest of Europe)

⇥ Asia-Pacific (India, Japan, China, South Korea, Australia, Indonesia Rest of Asia Pacific)

⇥ South America (Colombia, Brazil, Argentina, Rest of South America)

⇥ Middle East & Africa (Saudi Arabia, U.A.E., South Africa, Rest of Middle East & Africa)

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Chapter Outline

⏩ Market Overview: It contains five chapters, as well as information about the research scope, major manufacturers covered, market segments, High Bandwidth Memory (HBM) market segments, study objectives, and years considered.

⏩ Market Landscape: The competition in the Global High Bandwidth Memory (HBM) Market is evaluated here in terms of value, turnover, revenues, and market share by organization, as well as market rate, competitive landscape, and recent developments, transaction, growth, sale, and market shares of top companies.

⏩ Companies Profiles: The global High Bandwidth Memory (HBM) market's leading players are studied based on sales, main products, gross profit margin, revenue, price, and growth production.

⏩ Market Outlook by Region: The report goes through gross margin, sales, income, supply, market share, CAGR, and market size by region in this segment. North America, Europe, Asia Pacific, Middle East & Africa, and South America are among the regions and countries studied in depth in this study.

⏩ Market Segments: It contains the deep research study which interprets how different end-user/application/type segments contribute to the High Bandwidth Memory (HBM) Market.

⏩ Market Forecast: Production Side: In this part of the report, the authors have focused on production and production value forecast, key producers forecast, and production and production value forecast by type.

⏩ Research Findings: This section of the report showcases the findings and analysis of the report.

⏩ Conclusion: This portion of the report is the last section of the report where the conclusion of the research study is provided.

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People Also Ask:

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