Key Factor Supporting Three Dimensional (3D) Integrated Circuits (IC) Market Development in 2025: Growth Of The 3D IC Market Driven By The Rising Demand In The Semiconductor Industry

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How Large Will the Three Dimensional (3D) Integrated Circuits (IC) Market Size By 2025?
The market size for three-dimensional (3D) integrated circuits (IC) has seen a significant upsurge in the past few years. It is expected to expand from a substantial $12.41 billion in 2024 to an even larger $14.41 billion in 2025, growing at a compound annual growth rate (CAGR) of 16.1%. This impressive growth in the historical period can be associated with the escalating demand for progressive electronic goods, an increasing need for more efficient energy solutions, and a heightened call for electronics with greater performance.

How Big Is the Three Dimensional (3D) Integrated Circuits (IC) Market Size Expected to Grow by 2029?
The market size of three dimensional (3D) integrated circuits (IC) is projected to experience a steep increase in the coming years, reaching $25.83 billion by 2029 at a compound annual growth rate (CAGR) of 15.7%. This predicted growth within the forecast duration is tied to factors such as a surge in the need for smart devices and sophisticated integrations, intensified efforts in research and development, and the rising demand for 3D ICs in areas like servers, data centres as well as military and aerospace sectors. Other factors include increased requirements within the semiconductor industries and the flourishing of IoT and AI technologies. The forecast period anticipates trends such as persistent miniaturisation of devices, engaging more with advanced packaging technologies, heterogeneous device integrations, accentuated focus on sustainability and power efficiency, tailored 3D IC solutions for specific uses, the invention of improved materials for greater performance and efficiency, and the improvement of manufacturing processes to minimise costs.

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Which Key Market Drivers Powering Three Dimensional (3D) Integrated Circuits (IC) Market Expansion and Growth?
The surge in the semiconductor industry is forecasted to fuel the expansion of the three-dimensional (3D) integrated circuit (IC) market. This industry includes entities engaged in the creation, production, and distribution of semiconductor devices that are critical in various electronic goods such as computers, smartphones, and industrial equipment. Consumer electronics' spread, including smartphones, tablets, and wearable devices are significantly boosting the semiconductor industry. This, in turn, sparks the need for sophisticated semiconductor components. Additionally, the introduction of 5G networks necessitates novel semiconductor technologies for superior communication, rapid data transmission, and enhanced connectivity. 3D ICs bring several perks for semiconductor applications, comprising improved performance, enhanced power efficiency, space maximization, and efficient thermal management. For example, the Semiconductor Industry Association (SIA) reported in July 2024, that during May 2024, the world semiconductor market sales reached $49.1 billion, a surge of 19.3% compared to $41.2 billion in May 2023 and a boost of 4.1% relative to $47.2 billion in April 2024. Consequently, the rising demand for semiconductor industries paves the way for the growth of the three-dimensional (3D) integrated circuit (IC) market.

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Which Fast-Growing Trends Are Poised to Disrupt the Three Dimensional (3D) Integrated Circuits (IC) Market?
Leading firms in the Three Dimensional (3D) Integrated Circuits (IC) market are concentrating on designing custom-made 3D ICs for unique applications or client needs such as 5G radio frequency performance. This strategy helps these companies maintain a competitive edge, cater to specific market requirements, and increase income through distinctive solutions. The 3D IC technology boosts 5G, allowing integration of multiple high-speed parts into a single package, thereby bettering performance, decreasing latency, and facilitating a more compact and efficient network infrastructure along with devices. For instance, in May 2024, United Microelectronics Corporation, a multinational and semiconductor company based in Taiwan, unveiled the sector's premier 3D IC solution for radio frequency silicon on insulator (RFSOI) technology. This announcement signifies a substantial leap in the 5G era. This trailblazing technology, which is available on UMC's 55nm RFSOI platform, facilitates a reduction in circuit size by over 45%, thereby enabling more RF parts to be integrated into 5G devices. This ground-breaking 3D IC solution tackles the problem of radio frequency (RF) disruption, paving the way for future progression in 5G millimeter-wave (mmWave) technology.

What Are the Emerging Segments in the Three Dimensional (3D) Integrated Circuits (IC) Market?
The three dimensional (3D) integrated circuits (IC) market covered in this report is segmented -

1) By Components: Through Glass Vias (TGVs), Through Silicon Vias (TSVs), Other Components
2) By Technology: 3D Stacked Integrated Circuit (ICs), Monolithic 3D Integrated Circuit (ICs), Integration And Packaging Type
3) By Application: Aerospace And Industrial, Telecommunication And Information Technology (IT), Automotive, Consumer Electronics, Medical, Industrial, Other Applications

Subsegments:
1) By Through Glass Vias (TGVs): Glass Substrate For 3D ICs, TGV Fabrication Process, TGV Interconnects, High-Performance Glass For IC Packaging
2) By Through Silicon Vias (TSVs): Silicon Wafer For TSV Fabrication, TSV Interconnects and Via Formation, Copper TSVs, TSV Packaging Solutions, High-Density Tsvs For 3D ICs
3) By Other Components: Microbumps, Interposers, Microelectromechanical Systems (MEMS), Passive Components (Resistors, Capacitors), Thermal Management Components, Power Delivery Network (PDN) Components, Wafer Bonding Materials, Test And Inspection Components

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Who Are the Global Leaders in the Three Dimensional (3D) Integrated Circuits (IC) Market?
Major companies operating in the three dimensional (3D) integrated circuits (IC) market are Samsung Electronics Co. Ltd., Taiwan Semiconductor Manufacturing Company (TSMC), Intel Corporation, International Business Machines Corporation, Qualcomm Incorporated, SK Hynix Inc., Broadcom Inc., Micron Technology Inc., NVIDIA Corporation, Toshiba Corporation, Advanced Micro Devices Inc. (AMD), ASML Holding N.V., Texas Instruments Incorporated, MediaTek Inc., STMicroelectronics N.V., Infineon Technologies AG, NXP Semiconductors N.V., Analog Devices Inc., Renesas Electronics Corporation, United Microelectronics Corporation, ON Semiconductor Corporation, GlobalFoundries Inc., Microchip Technology Incorporated, Marvell Technology Group Ltd., JCET Group, Xilinx Inc., Silicon Labs Inc., Rambus Inc.

Which are the Top Profitable Regional Markets for the Three Dimensional (3D) Integrated Circuits (IC) Industry?
North America was the largest region in the three dimensional (3D) integrated circuit (IC) market in 2023. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the three dimensional (3D) integrated circuits (IC) market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

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