High Bandwidth Memory IP Market Share Driven by Server Integration and HBM3 Advancements | Valuates Reports

High Bandwidth Memory IP Market Size
The global High Bandwidth Memory IP market was valued at US$ 162 million in 2023 and is anticipated to reach US$ 317 million by 2030, witnessing a CAGR of 10.5% during the forecast period 2024-2030.
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The High Bandwidth Memory IP market is expanding rapidly, fueled by the increasing need for faster memory interfaces in data-intensive applications. As next-generation computing platforms demand low latency and ultra-high data throughput, HBM IP has become a critical enabler in system-on-chip (SoC) designs. These developments are contributing to rising market size and defining emerging market trends in data center infrastructure, internet services, and semiconductor integration.

By type, HBM3 currently leads the market share due to its superior bandwidth and energy efficiency, making it the preferred choice for high-end applications in AI, machine learning, and exascale computing. Its ability to support multi-terabyte per second data speeds positions it as a key technology in advanced processors and accelerators. HBM2 maintains a substantial portion of the market, especially in legacy server architectures and HPC workloads where it continues to deliver reliable performance and compatibility. The "Others" segment, which includes earlier generations or custom HBM variants, plays a niche role and contributes modestly to market growth through legacy system support and specialized applications.

In terms of application, the server segment dominates market share as enterprises and hyperscale cloud providers adopt HBM-integrated chips to improve compute throughput, reduce energy consumption, and handle growing AI model complexity. Internet applications, including large-scale content delivery, real-time streaming, and cloud-based gaming, are also accelerating adoption of HBM IP to support the surge in bandwidth demand and low-latency performance requirements. The "Others" category-spanning edge devices, embedded AI systems, and graphics accelerators-continues to grow steadily, adding diversity to the overall market size.

Looking ahead, the market forecast suggests strong continued growth as demand rises for high-performance memory interfaces within increasingly complex system architectures. The High Bandwidth Memory IP market is positioned to thrive, driven by ongoing semiconductor innovation, next-gen memory standards, and a global shift toward scalable, bandwidth-intensive computing solutions.

Segment by Type

• HBM2
• HBM3
• Others

Segment by Application

• Servers
• Internet
• Others

By Company

Global Unichip Corporation (GUC), Synopsys, Cadence Design Systems, Rambus, Alphawave, MSquare Technology, INNOSILICON Technology, Shanghai AkroStar Technology

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