HMC & HBM Market Share Driven by Data Center Expansion and High-Performance Computing | Valuates Reports

HMC & HBM - Market Size
The global market for HMC & HBM was estimated to be worth US$ 2415 million in 2023 and is forecast to a readjusted size of US$ 11110 million by 2030 with a CAGR of 24.2% during the forecast period 2024-2030

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The HMC & HBM market is experiencing robust growth as demand for ultra-fast, high-efficiency memory technologies surges across graphics, data centers, and advanced computing platforms. With their ability to deliver massive bandwidth in compact form factors, both Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) are shaping the future of memory architecture-boosting market size and driving critical market trends across latency-sensitive and compute-intensive sectors.

By type, High-bandwidth Memory (HBM) holds a dominant share of the market due to its widespread adoption in graphics processing units (GPUs), artificial intelligence (AI) accelerators, and high-performance computing (HPC) systems. HBM offers significant advantages in terms of power efficiency and memory density, making it the preferred choice for applications requiring rapid parallel data access. Hybrid Memory Cube (HMC), while contributing a smaller portion of market share, plays an important role in applications needing vertical stacking and serial interfaces to boost performance. Though its adoption is more niche, HMC continues to add value in certain HPC and networking solutions, contributing steadily to market growth.

In terms of application, the data centers segment leads the market share as operators increasingly integrate HBM-based accelerators to enhance workload efficiency, reduce energy consumption, and manage complex AI and machine learning tasks. High-performance computing is another key driver, with simulation, modeling, and scientific computing demanding ultra-high throughput and low-latency memory access, where both HBM and HMC excel. The graphics segment contributes strongly as well, with high-end GPUs and rendering engines leveraging these memory technologies for real-time processing and enhanced resolution support. Networking, including switches and routers in high-bandwidth communication systems, represents a growing application area-adding depth to the overall market size as next-generation networks demand more efficient memory performance.

Looking forward, the market forecast projects continued acceleration in adoption, fueled by advancements in chip packaging, increased memory stacking capabilities, and heightened compute requirements in AI, HPC, and cloud infrastructure. The HMC & HBM market is positioned for sustained expansion, aligned with the global shift toward faster, more efficient memory solutions in the era of high-performance and data-intensive computing.

Segment by Type:

• Hybrid Memory Cube (HMC)
• High-bandwidth Memory (HBM)

Segment by Application

• Graphics
• High-performance Computing
• Networking
• Data Centers

By Company

Samsung, Micron, SK Hynix, Intel, AMD, Advanced Micro Devices, Arira Design, IBM, Rambus, NVIDIA Corporation, Open-Silicon

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