Targeting Industry Pain Points, PrecisioNext Launches One-Stop 800G/1.6T Optical Module Placement Solution for Top Manufacturers

After nearly a year of rigorous testing and validation, PrecisioNext's DA403 high-precision die bonder for COB/COC has earned high recognition from the world's two largest optical module manufacturers. Both have signed volume supply agreements and commenced formal deliveries. This marks the first large-scale commercial deployment of domestically produced high-end optical module packaging equipment in the production of 400G/800G/1.6T related high-end products, signifying a breakthrough advancement for domestic equipment in the high-end optical module field.

Industry Pain Points in 400G/800G/1.6T Optical Module Production

The production of 400G/800G/1.6T optical modules faces several key challenges:
1. Numerous Components Requiring Placement: Products like multi-mode optical modules (components: VCSEL, PD, bonding wire resistors, TIA, Driver) and single-mode silicon photonics modules (components: PD, Lens blocks, TIA, FA blocks, PIC, COC, Field Lens) require handling many different parts. Traditional processes often use a single, inflexible chip feeding method, unable to support diverse chip types simultaneously. Consequently, modules with many components cannot be placed in one step, necessitating multiple placement and bake/cure cycles. Multiple baking cycles risk substrate warping, impacting subsequent placement accuracy and yield.
2. Stringent Placement Accuracy Requirements: Components like optical chips (VCSEL, PD) in these modules demand placement accuracy of at least ±3μm. Few domestic die bonder manufacturers can guarantee such precision. While imported equipment offers the accuracy, its extremely low Units Per Hour (UPH) rate creates a bottleneck. Achieving high UPH *while* maintaining precision is crucial for optical module manufacturers to reduce equipment investment costs.
3. High Technical Expertise Demands for Operation & Maintenance: Traditional high-precision placement equipment places extremely high demands on engineering technicians in both operation and maintenance. This leads to high manufacturer costs, difficulty recruiting qualified personnel, challenges in rapidly scaling production, and difficulty ensuring consistent yield. Reducing operator skill requirements and improving stability/efficiency is a key bottleneck for manufacturer expansion.

Providing a One-Stop 400G/800G/1.6T Optical Module Placement Solution

Addressing these pain points, PrecisioNext collaborated with top-tier customers to develop and deliver the DA403 series. This series supports both Chip-on-Board (COB) and Chip-on-Chip (COC) bonding. Designed with 5x 6-inch wafer rings and 1x 8-inch wafer ring, it supports feeding methods including 6-inch and 8-inch wafers, waffle packs, and gel packs. Crucially, it supports simultaneous placement of up to six different types of chip materials.

This enables a single machine to place components for both multi-mode modules (VCSEL, PD, bonding wire resistors, TIA, Driver) and single-mode silicon photonics modules (PD, Lens blocks, TIA, FA blocks, PIC, COC, Field Lens), effectively reducing equipment changeover time and eliminating multiple bake/cure cycles.

Its dual-ejector pin system design allows configuration for different customer products. Together, these features provide a One-Stop 400G/800G/1.6T Optical Module Placement Solution.

Key Features of the DA403 Series:
1. Flexible Placement Modes: Supports placing chips by type sequentially across the entire PCB, or completing all chips within a single Pad area before moving to the next Pad.
2. Dual-Ejector Pin System: Solves the compatibility issue of handling chips of vastly different sizes from blue tape feeders.
3. Dual Dispensing Options: Offers both dip coating and pneumatic dispensing. Pneumatic dispensing efficiently handles large chips that would require excessive dips, significantly boosting production efficiency.
4. Multi-Nozzle Support & Calibration: Supports up to 6 different nozzles based on chip size. Advanced calibration compensation algorithms after nozzle changes ensure placement accuracy requirements for multi-chip assembly are consistently met.

For a long time, the market for ultra-high-precision die bonders in high-end optical module packaging was monopolized by overseas players, leaving domestic manufacturers in a passive position with over-reliance on imports for procurement, maintenance, and technical support. This collaboration not only demonstrates PrecisioNext's technical strength in the high-end equipment domain but also signifies that the domestic substitution process for core equipment in cutting-edge optical module packaging fields like 800G/1.6T is accelerating, steadily moving towards high-end and international standards.

PrecisioNext: A Leading Enterprise in the Semiconductor Equipment Industry

As a leader in China's high-end semiconductor equipment sector, PrecisioNext consistently adheres to a development strategy of "Core Technology + Deep Application Scenarios." It has launched internationally advanced equipment spanning from traditional packaging to advanced packaging.

PrecisioNext's TCB (Thermo-Compression Bonding) equipment, the Loong series, achieves placement accuracy of ±1μm. It is the only domestically produced solution capable of handling 2.5D CoWoS packaging and 3D HBM stacking. PrecisioNext uniquely possesses mass transfer-based FOPLP (Fan-Out Panel Level Packaging) equipment. Starting with the board-level packaging project for Musk's Starlink, it has increased the efficiency of high-precision board-level packaging by an order of magnitude, gaining recognition from multiple global top-tier packaging houses. The upcoming CPO (Co-Packaged Optics) series packaging equipment, utilizing a self-developed nano-level motion control platform, will achieve ±0.3μm placement accuracy.

Website: https://www.precisionext.com/
E-mail: lidaodong@precisionext.com

PrecisioNext's TCB (Thermo-Compression Bonding) equipment, the Loong series, achieves placement accuracy of ±1μm. It is the only domestically produced solution capable of handling 2.5D CoWoS packaging and 3D HBM stacking. PrecisioNext uniquely possesses mass transfer-based FOPLP (Fan-Out Panel Level Packaging) equipment. Starting with the board-level packaging project for Musk's Starlink, it has increased the efficiency of high-precision board-level packaging by an order of magnitude, gaining recognition from multiple global top-tier packaging houses. The upcoming CPO (Co-Packaged Optics) series packaging equipment, utilizing a self-developed nano-level motion control platform, will achieve ±0.3μm placement accuracy.

This release was published on openPR.