SiC CMP Pads - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031

QY Research Inc. (Global Market Report Research Publisher) announces the release of 2025 latest report "SiC CMP Pads- Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031". Based on current situation and impact historical analysis (2020-2024) and forecast calculations (2025-2031), this report provides a comprehensive analysis of the global Wire Drawing Dies market, including market size, share, demand, industry development status, and forecasts for the next few years.

The global market for SiC CMP Pads was estimated to be worth US$ 48 million in 2024 and is forecast to a readjusted size of US$ 204 million by 2031 with a CAGR of 17.2% during the forecast period 2025-2031.

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SiC CMP Pads Market Summary
Chemical mechanical polishing/planarization (CMP) is a process that removes materials by a combination of chemical and mechanical (or abrasive) actions to achieve highly smooth and planar material surfaces. Chemical-mechanical polishing (CMP) is often associated with chemical-mechanical planarization which is a polishing process assisted by chemical reactions to remove surface materials. CMP is a standard manufacturing process practiced at the semiconductor industry to fabricate integrated circuits and memory disks. When the purpose is to remove surface materials, it is referred to as chemical-mechanical polishing. However, when the purpose is to flatten a surface, it is referred to as chemical-mechanical planarization. CMP is considered to be a tribochemical process because of the synergy between friction and corrosion. CMP Pad (Chemical Mechanical Polishing Pad) is a product which increases semiconductor integration by smoothening the semiconductor wafer surface through physical and chemical polishing processes.
SiC CMP pads are polishing pads used in the Chemical Mechanical Planarization (CMP) process for semiconductor manufacturing, specifically for Silicon Carbide (SiC) wafers. CMP is a process used to smooth and flatten the surface of a semiconductor wafer to ensure that the layers of material deposited during fabrication are evenly distributed. This is especially important for high-performance devices such as power semiconductors, which use SiC due to its superior thermal conductivity and electrical properties.
SiC wafers are harder and more challenging to polish than traditional silicon wafers, so specialized CMP pads are designed to handle the mechanical and chemical stresses involved. These pads are typically made from materials like polyurethane, which have a good balance of hardness and flexibility, and are optimized to work with specific slurry solutions in the CMP process.
The primary role of SiC CMP pads is to ensure that the wafer surface is planarized, with minimal damage or defects, in order to produce high-quality SiC devices, such as those used in power electronics or high-frequency applications.

The silicon carbide (SiC) chemical mechanical planarization (CMP) pads market is evolving rapidly, driven by the booming demand for SiC power devices in electric vehicles (EVs), renewable energy, and 5G infrastructure. Below are the key industry trends shaping the future of SiC CMP pads.

The global SiC CMP Pads market was valued at US$ 47.97 million in 2024 and is expected to reach US$ 204.18 million by 2031, growing at a CAGR of 17.15% during 2025-2031. The silicon carbide (SiC) chemical mechanical planarization (CMP) pad market is a critical enabler for next-generation power electronics, with distinct competitive dynamics and technological challenges.

The current market-oriented enterprises in China have not obtained foreign certifications, so there is no export for the time being. Because downstream companies are mainly concentrated in Japan, Taiwan, South Korea, Europe and United States and other countries. The electronics industry is mainly concentrated in the Asia-Pacific region, but the current political situation is not optimistic, it may be the most serious year for China's political crisis in the past 30 years. Due to the current trade frictions and China's current international political factors, it may be the best time for domestic SiC CMP Pads manufacturers to occupy the market, and the country's policy investment will increase in the coming years. Therefore, Chinese companies will usher in opportunities for localization in the next few years. We predict that in order to occupy the market, Hubei Dinglong may actively lower the price of the product and madly occupy the market.

At present, considering the cost and the influence of the size of silicon wafers on the performance and efficiency of integrated circuits, the increase in the size of wafers is an inevitable trend and a mainstream trend, in particular, 8-inch and 12-inch. Wafer may develop in the direction of 18 inches in the future. However, the larger the size, the more difficult it is to produce the corresponding CMP pad. When the downstream size becomes an inevitable trend, in order to occupy the market, it is necessary to be able to develop large-size pad, otherwise it will be eliminated by the market. With the expectation of the superior performance improvement of integrated circuits, the polishing performance of CMP pads has to be increased, so its performance in the future must be more stringent.

The global key companies of SiC CMP Pads include DuPont, Fujibo Group, Entegris, IVT Technologies, and etc. In 2024, the global three largest players hold a share 90.64% in terms of revenue. New investment requires large capital, and it is difficult for small-scale enterprises to enter the industry. SiC CMP Pads have higher requirements on technology level and processing technology. At present, the market is occupied by American companies. The market is not only influenced by the price, but also influenced by the product performance. The leading companies own the advantages on better performance, more abundant product's types, better technical and impeccable after-sales service. Consequently, they take the majority of the market share of high-end market. Looking to the future years, prices gap between different brands will go narrowing. Similarly, there will be fluctuation in gross margin.

For manufacturers that have already entered, they need to constantly raise the technical threshold to prevent more companies from entering; by reducing costs and reducing prices, they will quickly occupy the market, develop incremental customer markets, and establish market share advantages; create a brand image and lay an advantage for entering the consumer goods market. Only in this way can we have a larger market share of capital in the fierce competition.
Figure. Global SiC CMP Pads Market Size (US$ Million), 2024 vs 2031
SiC CMP pads
Above data is based on report from QYResearch: Global SiC CMP Pads Market Report 2025-2031 (published in 2025). If you need the latest data, plaese contact QYResearch.
Figure. Global SiC CMP Pads Top 4 Players Ranking and Market Share (Ranking is based on the revenue of 2024, continually updated)
SiC CMP pads
Above data is based on report from QYResearch: Global SiC CMP Pads Market Report 2025-2031 (published in 2025). If you need the latest data, plaese contact QYResearch.

According to QYResearch Top Players Research Center, the global key manufacturers of SiC CMP Pads include DuPont, Fujibo Group, etc. In 2024, the global top three players had a share approximately 91.0% in terms of revenue.
Figure. SiC CMP Pads, Global Market Size, Split by Product Segment
SiC CMP pads

Based on or includes research from QYResearch: Global SiC CMP Pads Market Report 2025-2031.

In terms of product type, currently Soft Pads is the largest segment, hold a share of 50.9%.

In terms of product application, currently 6 Inch SiC Wafer is the largest segment, hold a share of 71.7%.

The report provides a detailed analysis of the market size, growth potential, and key trends for each segment. Through detailed analysis, industry players can identify profit opportunities, develop strategies for specific customer segments, and allocate resources effectively.

The SiC CMP Pads market is segmented as below:
By Company
DuPont
Fujibo Group
Entegris
IVT Technologies
Hubei Dinglong
Wuxi Jizhi Electronic Technology

Segment by Type
Hard Pads
Soft Pads

Segment by Application
4 Inch SiC Wafer
6 Inch SiC Wafer
8 Inch SiC Wafer

Each chapter of the report provides detailed information for readers to further understand the SiC CMP Pads market:

Chapter 1: Introduces the report scope of the SiC CMP Pads report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry. (2020-2031)
Chapter 2: Detailed analysis of SiC CMP Pads manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc. (2020-2025)
Chapter 3: Provides the analysis of various SiC CMP Pads market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments. (2020-2031)
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.(2020-2031)
Chapter 5: Sales, revenue of SiC CMP Pads in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world..(2020-2031)
Chapter 6: Sales, revenue of SiC CMP Pads in country level. It provides sigmate data by Type, and by Application for each country/region.(2020-2031)
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc. (2020-2025)
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

Benefits of purchasing QYResearch report:

Competitive Analysis: QYResearch provides in-depth SiC CMP Pads competitive analysis, including information on key company profiles, new entrants, acquisitions, mergers, large market shear, opportunities, and challenges. These analyses provide clients with a comprehensive understanding of market conditions and competitive dynamics, enabling them to develop effective market strategies and maintain their competitive edge.

Industry Analysis: QYResearch provides SiC CMP Pads comprehensive industry data and trend analysis, including raw material analysis, market application analysis, product type analysis, market demand analysis, market supply analysis, downstream market analysis, and supply chain analysis.

and trend analysis. These analyses help clients understand the direction of industry development and make informed business decisions.

Market Size: QYResearch provides SiC CMP Pads market size analysis, including capacity, production, sales, production value, price, cost, and profit analysis. This data helps clients understand market size and development potential, and is an important reference for business development.

Other relevant reports of QYResearch:
Global SiC CMP Pads Market Insights, Forecast to 2031
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Global SiC CMP Pads Market Research Report 2025
SiC CMP Pads- Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031
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SiC CMP Pads - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030
Global SiC CMP Pads Market Research Report 2024
SiC CMP Pads - Global Market Insights and Sales Trends 2024
Global SiC CMP Pads Market Research Report 2023
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Global SiC CMP Pads Industry Research Report, Growth Trends and Competitive Analysis 2023-2029
Global SiC CMP Pads Market Report, History and Forecast 2018-2029, Breakdown Data by Manufacturers, Key Regions, Types and Application

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