CMP Pads Research:CAGR of 6.8% during the forecast period

CMP Pads Market Summary
Chemical mechanical polishing/planarization (CMP) is a process that removes materials by a combination of chemical and mechanical (or abrasive) actions to achieve highly smooth and planar material surfaces. Chemical-mechanical polishing (CMP) is often associated with chemical-mechanical planarization which is a polishing process assisted by chemical reactions to remove surface materials. CMP is a standard manufacturing process practiced at the semiconductor industry to fabricate integrated circuits and memory disks. When the purpose is to remove surface materials, it is referred to as chemical-mechanical polishing. However, when the purpose is to flatten a surface, it is referred to as chemical-mechanical planarization. CMP is considered to be a tribochemical process because of the synergy between friction and corrosion. CMP Pad (Chemical Mechanical Polishing Pad) is a product which increases semiconductor integration by smoothening the semiconductor wafer surface through physical and chemical polishing processes.

According to the new market research report "Global CMP Pads Market Report 2025-2031", published by QYResearch, the global CMP Pads market size is projected to reach USD 1.71 billion by 2031, at a CAGR of 6.8% during the forecast period.
At present, considering the cost and the influence of the size of silicon wafers on the performance and efficiency of integrated circuits, the increase in the size of wafers is an inevitable trend and a mainstream trend, in particular, 8-inch and 12-inch. Wafer may develop in the direction of 18 inches in the future. However, the larger the size, the more difficult it is to produce the corresponding CMP pad. When the downstream size becomes an inevitable trend, in order to occupy the market, it is necessary to be able to develop large-size pad, otherwise it will be eliminated by the market. With the expectation of the superior performance improvement of integrated circuits, the polishing performance of CMP pads has to be increased, so its performance in the future must be more stringent.
Several of the current market-oriented enterprises in China have not obtained foreign certifications, so there is no export for the time being. Because downstream companies are mainly concentrated in Japan, Taiwan, South Korea, Europe and the United States and other countries, in addition to Europe and South Korea, these countries have a relatively large market position of CMP polishing pads in several other regions. The electronics industry is mainly concentrated in the Asia-Pacific region, but the current political situation is not optimistic, especially in 2020, it may be the most serious year for China's political crisis in the past 30 years. Due to the current trade frictions and China's current international political factors, it may be the best time for domestic CMP pad manufacturers to occupy the market, and the country's policy investment will increase in the coming years. Therefore, Chinese companies will usher in opportunities for localization in the next few years. We predict that in order to occupy the market, Hubei Dinglong may actively lower the price of the product and madly occupy the market.
New investment requires large capital, and it is difficult for small-scale enterprises to enter the industry. CMP Pads has higher requirements on technology level and processing technology. At present, the market is occupied by American companies. The market is not only influenced by the price, but also influenced by the product performance. The leading companies own the advantages on better performance, more abundant product's types, better technical and impeccable after-sales service. Consequently, they take the majority of the market share of high-end market. Looking to the future years, prices gap between different brands will go narrowing. Similarly, there will be fluctuation in gross margin.
For manufacturers that have already entered, they need to constantly raise the technical threshold to prevent more companies from entering; by reducing costs and reducing prices, they will quickly occupy the market, develop incremental customer markets, and establish market share advantages; create a brand image and lay an advantage for entering the consumer goods market. Only in this way can we have a larger market share of capital in the fierce competition.

Figure. Global CMP Pads Market Size (US$ Million), 2020-2031
CMP Pads
Above data is based on report from QYResearch: Global CMP Pads Market Report 2025-2031 (published in 2025). If you need the latest data, plaese contact QYResearch.

Figure. Global CMP Pads Top 10 Players Ranking and Market Share (Ranking is based on the revenue of 2024, continually updated)
CMP Pads
Above data is based on report from QYResearch: Global CMP Pads Market Report 2025-2031 (published in 2025). If you need the latest data, plaese contact QYResearch.

According to QYResearch Top Players Research Center, the global key manufacturers of CMP Pads include DuPont, Entegris, Hubei Dinglong, Fujibo, SK enpulse, etc. In 2024, the global top five players had a share approximately 93.0% in terms of revenue.
Figure. CMP Pads, Global Market Size, Split by Product Segment
CMP Pads

Based on or includes research from QYResearch: Global CMP Pads Market Report 2025-2031.

In terms of product type, currently Polymer CMP Pad is the largest segment, hold a share of 89.9%.

In terms of product application, currently 300mm Wafer is the largest segment, hold a share of 74.0%.

Focusing on the electronics and communications field for a long time, she has observed, followed up and researched on various links in the industry chain, such as semiconductors, consumer electronics, home appliances, fiber optic communications, Internet of Things (IoT) and smart home for a long time. He has rich experience in industry research and has completed many successful cases.

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