SundanceDSP Unveils the SE300: The Biggest Little FPGA Board for High-Performance Embedded Systems

Reno, Nevada - [May 20, 2025]- SundanceDSP, a leading provider of advanced signal processing solutions, proudly announces the launch of the SE300, a high-performance, multi-purpose embedded multi-FPGA solution designed to meet the demands of MIMO systems, defense, aerospace, and high-speed signal processing applications.

With its flexible clocking architecture and four FMC+ interfaces, the SE300 offers unmatched scalability, making it an ideal choice for high-density ADC and DAC configurations, including compatibility with SundanceDSP's FMCP-ADC3p0 and FMCP-DAC12p0. The system supports long-distance data capture and processing through Samtec's Firefly® technology, ensuring seamless high-speed communication across distributed environments.

At its core, the SE300 features a Microchip PolarFire® SoC MPFS460T-FCG1152, coupled with four MPF500T-FCG1152 PolarFire FPGAs, offering a balanced combination of low-power, high-performance processing and a flexible clock tree with JESD204B inter-chip synchronization for coherent multi-board integration.

"SundanceDSP continues to push boundaries with innovative FPGA solutions, and the SE300 exemplifies that commitment," said Dr Nory Nakhaee, CEO of SundanceDSP. "As a company based in Reno-the Biggest Little City in the World-we take pride in delivering one of the most compact yet powerful FPGA boards available today, designed for scalability in high-performance applications."

The SE300 includes a 5-core RISC-V® processor, seamlessly integrating programmable logic and microprocessing system (MSS) capabilities. The platform boasts robust connectivity options, including dual SODIMM connectors for MSS and PL interfaces, RJ45 Ethernet, USB 2.0, SFP+, mPCIe, SATA, and JTAG chain support across all units.

The system's clocking infrastructure, based on HMC7044, provides precise synchronization, while high-speed transceivers and LVDS mesh connections enable efficient inter-unit communication. With separately regulated VADJ for FMC+ slots and dedicated Firefly interfaces for each slave site, the SE300 is engineered for customizable high-bandwidth processing.

"By leveraging the high-performance, power-efficient design of our small footprint PolarFire SoC and FPGA devices, SundanceDSP has created the SE300 a compact yet powerful platform that enables scalable, synchronized and secure embedded processing," said Shakeel Peera, vice president of marketing and strategy for Microchip's FPGA business unit.

SE300 delivers high-density, low-power processing that is ideal for defense, electronic warfare, telecommunications, and test and measurement systems applications.

Now available for shipment, interested customers can contact SundanceDSP to reserve their requirements and ensure early access to this next-generation FPGA solution.

For inquiries, please visit SE300 or contact sales@sundancedsp.com.

1575 Delucchi Lane Suite 215, Reno NV 89502

SundanceDSP is a leading provider of high-performance signal processing solutions, specializing in embedded FPGA platforms, real-time processing, and scalable multi-FPGA architectures. Based in Reno, NV, the company serves aerospace, defense, communications, and research industries, delivering cutting-edge technology tailored for high-density computing applications.

This release was published on openPR.