Molded Interconnect Substrate (MIS) Research:CAGR of 10.8% during the forecast period

QY Research Inc. (Global Market Report Research Publisher) announces the release of 2025 latest report "Molded Interconnect Substrate (MIS)- Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031". Based on current situation and impact historical analysis (2020-2024) and forecast calculations (2025-2031), this report provides a comprehensive analysis of the global Wire Drawing Dies market, including market size, share, demand, industry development status, and forecasts for the next few years.



The global market for Molded Interconnect Substrate (MIS) was estimated to be worth US$ 98 million in 2024 and is forecast to a readjusted size of US$ 228 million by 2031 with a CAGR of 12.2% during the forecast period 2025-2031.



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Molded Interconnect Substrate (MIS) Market Summary

Molded Interconnect Substrate Technology (MIS) is a novel substrate solution that is ideal for mobile industry. It encompasses a wide range of solutions for the complex needs of IC package for mobile applications. With its embedded copper trace technology, it enable a finer line and space that is needed for high I/O count with smaller form factor. It also provides a robust Flip Chip assembly process. Another important feature of MIS substrate is copper filled-via and filled-pad technologies, which is significantly important for high frequency requirements, and improve thermal dissipation.

According to the new market research report "Global Molded Interconnect Substrate (MIS) Market Report 2025-2031", published by QYResearch, the global Molded Interconnect Substrate (MIS) market size is projected to reach USD 0.21 billion by 2031, at a CAGR of 10.8% during the forecast period.



Global Molded Interconnect Substrate (MIS) MarketSize(US$ Million), 2020-2031
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Above data is based on report from QYResearch Semiconductor Research Center: Global Molded Interconnect Substrate (MIS) Market Report 2025-2031 (published in 2025). If you need the latest data, plaese contact QYResearch.

Currently the global MIS substrates are produced by Taiwanese PPt, Chineses MiSpak Technology and Malaysian QDOS.

PPt now can supply 1 layer, 2 layer, 3 layer, 4 layer and 6 layer MIS substrates. MiSpak Technology supplies 1 layer and 2 layer MIS substrates. QDOS supplies 1 layer, 2 layer and 3 layer MIS substrates

The growth potential of MIS products in the substrate application market will come from network communication products such as servers and data centers, automotive electronic control equipment driven by electric vehicles and automotive intelligence, as well as 5G, AIoT and other applications. With the launch of these related products, the requirements for substrates used in semiconductor packaging will also increase significantly, requiring a high degree of design flexibility, improved performance and high reliability.

In terms of advanced lead frame products, MIS manufacturers (PPt, MiSpak and QDOS) mainly supply products that are not limited to single-layer boards. PPt can also provide multi-layer board windable lead frame products for multi-chip packaging, which are products that are difficult for traditional lead frame suppliers to provide.

Currently the MIS substrates are mainly used in power/PMIC/analog, automotive electronics, RF/5G, Optical Image Stabilization (OIS), fingerprint recognition, third generation semiconductor, and LED, etc. Most of MIS substrates are used in power segment. For third generation semiconductor, MIS substrates are mainly used in GaN devices.



Global Molded Interconnect Substrate (MIS) Top3Players Ranking and Market Share (Ranking is based on the revenue of 2024, continually updated)
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Above data is based on report from QYResearch Semiconductor Research Center: Global Molded Interconnect Substrate (MIS) Market Report 2025-2031 (published in 2025). If you need the latest data, plaese contact QYResearch.







The report provides a detailed analysis of the market size, growth potential, and key trends for each segment. Through detailed analysis, industry players can identify profit opportunities, develop strategies for specific customer segments, and allocate resources effectively.



The Molded Interconnect Substrate (MIS) market is segmented as below:

By Company

PPt
MiSpak Technology
QDOS



Segment by Type

1 Layer MIS Substrate
2 Layer MIS Substrate
3 Layer MIS Substrate
4 Layer MIS Substrate
6 Layer MIS Substrate
Others



Segment by Application

Analog Chip
Power IC
RF/5G
Fingerprint Sensor
OIS (Optical Image Stablization)
Others



Each chapter of the report provides detailed information for readers to further understand the Molded Interconnect Substrate (MIS) market:

Chapter 1: Introduces the report scope of the Molded Interconnect Substrate (MIS) report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry. (2020-2031)

Chapter 2: Detailed analysis of Molded Interconnect Substrate (MIS) manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc. (2020-2025)

Chapter 3: Provides the analysis of various Molded Interconnect Substrate (MIS) market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments. (2020-2031)

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.(2020-2031)

Chapter 5: Sales, revenue of Molded Interconnect Substrate (MIS) in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world..(2020-2031)

Chapter 6: Sales, revenue of Molded Interconnect Substrate (MIS) in country level. It provides sigmate data by Type, and by Application for each country/region.(2020-2031)

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc. (2020-2025)

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.



Benefits of purchasing QYResearch report:

Competitive Analysis: QYResearch provides in-depth Molded Interconnect Substrate (MIS) competitive analysis, including information on key company profiles, new entrants, acquisitions, mergers, large market shear, opportunities, and challenges. These analyses provide clients with a comprehensive understanding of market conditions and competitive dynamics, enabling them to develop effective market strategies and maintain their competitive edge.

Industry Analysis: QYResearch provides Molded Interconnect Substrate (MIS) comprehensive industry data and trend analysis, including raw material analysis, market application analysis, product type analysis, market demand analysis, market supply analysis, downstream market analysis, and supply chain analysis.

and trend analysis. These analyses help clients understand the direction of industry development and make informed business decisions.

Market Size: QYResearch provides Molded Interconnect Substrate (MIS) market size analysis, including capacity, production, sales, production value, price, cost, and profit analysis. This data helps clients understand market size and development potential, and is an important reference for business development.



Other relevant reports of QYResearch:

Global Molded Interconnect Substrate (MIS) Sales Market Report, Competitive Analysis and Regional Opportunities 2025-2031
Global Molded Interconnect Substrate (MIS) Market Insights, Forecast to 2031
Global Molded Interconnect Substrate (MIS) Market Research Report 2025
Global Molded Interconnect Substrate (MIS) Market Insights, Forecast to 2030
Global and United States Molded Interconnect Substrate (MIS) Market Report & Forecast 2024-2030
Molded Interconnect Substrate (MIS)- Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030
Global Molded Interconnect Substrate (MIS) Market Research Report 2024

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