Panel Level Packaging Market Size Expansion to Drive Significant Revenues in the Future - 2032

The demand for lower costs plus higher performance, coupled with OSAT assembly house end-customers' desire for increasingly lower prices, has driven the semiconductor industry to develop innovative solutions. One approach for reducing overall cost is to move to a larger-size panel format. This technology, named panel level packaging takes advantage of efficiency and economies of scale.

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Cost-effective packaging solution and flexible circuit designs are some of the major influencing factors for the growth of panel-level packaging technology. Especially, the recent panel level package technology is a promising area of market advancement in the global semiconductor packaging industry. Smaller form factor with enhanced thermal performance has generated huge demand for panel-level packaging technology among several industrial applications such as consumer electronics, automotive, aerospace & defense, telecommunication, and others.

COVID-19 Impact Analysis

With the outbreak of COVID 19, the panel level packaging market witnessed a decline in growth due to restrictions on the movement of goods and severe disruptions in the semiconductor supply chain. COVID-19 caused low inventory levels for clients of semiconductor vendors and distribution channels. the semiconductor industry experiences a slowdown in demand and production disruption.

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However, in the pandemic period, panel-level packaging finds its increased application in footprint-sensitive devices such as smartphones due to the requirement of high-performing, energy-efficient thin- and small-form-factor packages.

The latest trend in packaging is panel-level packaging, which is a promising area of market advancement in the global panel-level packaging industry. Players such as ASE, Powertech, Nepes, and Samsung are looking forward to panel -level packaging, providing economies of scale.

Players such as Mi Technovation Bhd are primarily involved in the design, manufacturing, and sale of wafer-level chip scale package and sorting machines with inspection and testing capabilities for the semiconductor industry. Furthermore, Taiwan Semiconductor Manufacturing Company (TSMC) announced in October 2019 that it would increase its Capex, providing advanced solutions in the panel packaging.

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Several packaging houses are implementing panel-level fan-out, a low-density technology that promises to lower the cost of fan-out. Fan Out Panel Level Packaging (FOPLP) is expected to be essential for future applications on 5G, AI, Biotech, Advanced Driver- Assistance System (ADAS), smart city, and IoT-related products. Ability to develop advanced packing and testing services and secure customer relations serve as major factors.

The semiconductors enable a wide variety of products for smartphones and computers and the demand for these devices is increasing year on year. A positive outlook for IoT and artificial intelligence increases the growth of the semiconductor industry which in turn would require intensive use of panel-level technologies.

Key Benefits of the Report:

1. This study presents the analytical depiction of panel level packaging market industry along with the current trends and future estimations to determine the imminent investment pockets.

2. The report presents information related to key drivers, restraints, and opportunities along with a detailed analysis of panel level packaging market.

3. The current market is quantitatively analyzed to highlight of the level of packaging market growth scenario.

4. Porter's Five Forces analysis illustrates the potency of buyers & suppliers in the market.

5. The report provides a detailed panel-level packaging market analysis based on competitive intensity and the competition that will take shape in the coming years.

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