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Thin Wafer Processing and Dicing Equipment Market - Global Industry Analysis, Size, Share, Growth, Trends and Forecast 2016 - 2024

11-14-2016 06:40 PM CET | IT, New Media & Software

Press release from: TMR Research Reports

A wafer is a thin slice of semi-conductor material. Dicing is the process which is used to cut, or groove semiconductors, glass, crystal, and many other types of material. The instrument used during this process is known as dicing equipment. The dicing technologies are constantly evolving due to the rising demand in thinner wafers and stronger die, thereby making a significant impact on the dicing equipment industry. Grinding is the procedure in which wafer thickness is reduced according to the needs of different industries such as electronics, automotive, and communication devices, among others. The thin wafer market is expected to grow at a steady pace in the forecast period.

The demand for thin wafers is mainly driven by increasing demand in consumer electronics. The new configurations in consumer electronics such as compact memory and wireless devices are triggering the need for thinning wafer and dicing technology as well. High interconnect density, better electrical performance, and reduced size are some of the factors behind the growth trend of the market. Thinning technology, the key technology to obtain miniaturization, is propelled by the growing need of ultra-thin wafers in packaging, communication devices, and smart cards, among others.

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However, the key restraint in thin wafer processing industry arises when thickness decrease to

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