Plastic Carrier Tape for Semiconductor Market Set for 7.3% CAGR Growth, Hitting $1173 Million by 2030

Plastic Carrier Tape for Semiconductor Market Overview -

According to QYResearch New Study Report 'Plastic Carrier Tape for Semiconductor Market 2024' provides a comprehensive analysis of the industry with market insights will definitely facilitate to increase the knowledge and decision-making skills of the business, thus providing an immense opportunity for growth. Finally, this will increase the return rate and strengthen the competitive advantage within. Since it's a personalised market report, the services are catered to the particular difficulty. The correct methodology and staff will be matched to the company need through marketing reports, which may involve survey work, in-depth interviews, or a combination of methodologies. also qualitative and quantitative analysis, we help you with thorough and comprehensive research on the global Plastic Carrier Tape for Semiconductor market. We have also focused on SWOT, PESTLE, and Porter's Five Forces analyses of the global Plastic Carrier Tape for Semiconductor market.

The global market for Plastic Carrier Tape for Semiconductor was estimated to be worth US$ 700 million in 2023 and is forecast to a readjusted size of US$ 1173 million by 2030 with a CAGR of 7.3% during the forecast period 2024-2030.

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Carrier tape is a type of strip product applied in the field of electronic packaging. It has a specific thickness and is evenly distributed with holes (also known as pockets) for placing electronic components and indexing holes for positioning along its length. Carrier tape can be categorized by material into paper carrier tape and plastic carrier tape. Paper tape has the advantages of low cost and easy handling, making it suitable for packaging chip components with a thickness not exceeding 1mm, and it is mainly used for passive components such as RCL. Plastic carrier tape is used for thicker components, suitable for active components like integrated circuits, semiconductor products, and thicker passive components. Plastic carrier tape products can be further divided into black plastic carrier tape and transparent plastic carrier tape. Black carrier tape is mainly used in high-end electronic components such as the semiconductor market due to its good electrical conductivity, while transparent plastic carrier tape is mainly used in the mid to low-end market.

Carrier tapes mainly include paper carrier tapes and plastic carrier tapes, which are mainly used in the downstream electronic component mounting industry, but there are obvious differences in specific uses. Paper carrier tapes can only be used for chip components with a thickness of less than 1mm, and chip components with a thickness of more than 1mm can only use plastic carrier tapes. In other words, paper carrier tapes are mainly used for passive components, while plastic carrier tapes are mainly used for active components. The semiconductor scope of this article mainly covers four aspects: integrated circuits (chips/processors, etc.), power discrete devices, optoelectronic devices, and sensors.

The production areas of plastic carrier tapes in various regions of the world are mainly distributed in the United States, China (including Taiwan), Japan, Southeast Asia and other countries. In terms of corporate share, the leading companies in the United States and Japan occupy most of the market share. There is still a large gap between Chinese plastic carrier tape companies and international leading companies (such as 3M and Advantek) in terms of production capacity, product performance, brand effect, etc., but as Chinese companies have made continuous breakthroughs in product development technology in recent years, some companies have also gained a certain market share from the leading plastic carrier tape companies, such as Zhejiang Jiemei Electronic Technology, whose semiconductor customers include Infineon, Huatian Technology, Nexperia, etc.

Currently, the two most commonly used types are PS and PC carrier tape. In 2023, the market share of these two types will exceed 80%. The core difference is the material. PC has good flame retardant properties, while PS has poor fire retardant properties and is flammable. It is expected that the share of PC carrier tape will remain at around 46% in the next few years.

This report aims to provide a comprehensive presentation of the global market for Plastic Carrier Tape for Semiconductor, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Plastic Carrier Tape for Semiconductor by region & country, by Type, and by Application.

Market The Driving Factors:-

Growing customer demand for the product, effective marketing strategies in new states, and significant investments in product development are some of the major reasons that are driving the Plastic Carrier Tape for Semiconductor industry. One of the biggest problems the Plastic Carrier Tape for Semiconductor industry is facing is easy access to rivals. The inexpensive cost of alternatives is another barrier to the Plastic Carrier Tape for Semiconductor market. Companies believe they can overcome this obstacle, though, by keeping pricing in check and expanding the market for their goods through the introduction of chemicals, specialized chemicals, polymers, metals, ceramics, composites, and new materials. Furthermore, market participants need to overcome significant obstacles in order to reduce risks, adjust their plans, and carry on with business as usual. As a result, businesses will have the ability to deploy their resources efficiently without sacrificing timely market supply or product quality.

Global Plastic Carrier Tape for Semiconductor Market Trends:-

Plastic Carrier Tape for Semiconductor The pre- and post-period regulatory situation plays an important role in shaping market dynamics. As governments introduce and refine regulations governing the production, distribution, and sale of Plastic Carrier Tape for Semiconductor products, businesses must navigate complex compliance requirements to ensure lawful operations. Regulatory clarity and consistency are key factors that positively impact markets, providing certainty for businesses and giving people confidence in product safety and quality standards. Additionally, regulatory developments such as the approval of Plastic Carrier Tape for Semiconductor chemical and material products and the establishment Plastic Carrier Tape for Semiconductor of cultivation programs are opening up new opportunities for market expansion while setting standards for best practices in the industry.

Detailed of Plastic Carrier Tape for Semiconductor Market Segmentation: -

Segmentation By Type :-

Polycarbonate
Polystyrene
Polyethylene Terephthalate
Polypropylene
Others

Segmentation By Application : -

Power Discrete Devices
Integrated Circuit
Optoelectronics
Others

Who are the World's Largest Manufacturers of Plastic Carrier Tape for Semiconductor?

3M, Advantek, Shin-Etsu Polymer, Nissho Corporation, Zhejiang Jiemei Electronic Technology, NIPPO CO.,LTD, YAC GARTER, U-PAK, C-Pak, ePAK International, ROTHE, Sumitomo Bakelite, Tek Pak, Jiangyin Winpack, SEKISUI SEIKEI, Asahi Kasei, Kanazu Giken, Taiwan Carrier Tape Enterprise Co., Ltd, LaserTek, JSK Co.,Ltd, Miyata System, Hwa Shu Enterpris, Xiamen Hatro Electronics

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Regional Insights and Growth Opportunities :-

The Plastic Carrier Tape for Semiconductor Market is witnessing dynamic growth globally, but the market expansion is not uniform across regions. Our comprehensive report breaks down the Plastic Carrier Tape for Semiconductor market performance into key regions, providing detailed insights and growth forecasts for each area.

Key Regions Covered in the Report:

North America
Europe
Asia-Pacific
Latin America
Middle East & Africa

Highlights the following key factors:

Business description - An in-depth description of the businesses and the divisions of the company.

Corporate strategy - Business strategy of the company as summarized by analysts.

SWOT Analysis - An in-depth analysis of the company's advantages, disadvantages, strengths, and threats.

Company history - progression of significant company-related events.

Major products and services - A list of the company's major products, services, and brands.

Key competitors - A list of the primary competitors of the company.

Important locations and subsidiaries - A list of the company's key locations and subsidiaries, along with contact details.

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of Plastic Carrier Tape for Semiconductor manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Sales, revenue of Plastic Carrier Tape for Semiconductor in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Sales, revenue of Plastic Carrier Tape for Semiconductor in country level. It provides sigmate data by Type, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.

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